Samsung 164BX Benutzerhandbuch

Memory and Microprocessor Configuration

3. Place the GRAFOIL pad on the gold-plated slug surface and align it with 

the threaded studs.

b.

Attach the microprocessor heat sink. The heat-sink material is clear anod-
ized, hot-water-sealed, 6061-T6 aluminum. The nut material is 2011-T3 alu-
minum (this grade is critical). Perform the following steps to attach the heat 
sink: 

1. Observe antistatic precautions.

2. Align the heat-sink holes with the threaded studs on the ceramic package.

3. Handle the heat sink by the edges and lower it onto the chip package, 

taking care not to damage the stud threads.

4. Set a calibrated torque driver to 20 in-lbs, ±2 in-lbs (2.3 Nm, ±0.2 Nm). 

The torque driver should have a mounted 7/16-inch socket.

5. Insert a nut into the 7/16-inch socket, place on one of the studs, and 

tighten to the specified torque. Repeat for the second nut.

6. If the sink/chip/fan clip is used, properly install it by positioning it over 

the assembly and hooking its ends around the ZIF socket retainers.

c.

Attach the heat-sink fan assembly:

1. Place the fan assembly on top of the heat sink, aligning the fan mounting 

holes with the corresponding threaded heat-sink holes. Align the fan so 
that the fan power/sensor wires exit the fan closest to connector J35 (see 
Figure 2–1). Fan airflow must be directed into the heat sink (fan label 
facing down toward the heat sink). 

2. Place the fan guard on top of the fan. Orient the guard so that the corner 

mounting areas lay flush against the heat sink.

3. Secure the fan and fan guard to the heat sink with four 6-32 

X

 0.875-inch 

screws.

4. Plug the fan power/sensor cable into connector J35.

When installing the microprocessor, you must change the frequency of 
its clock output by setting the CPU speed selection jumpers (J28 Option 
1~4), as described in Section 3.1.