Intel 2 Duo U7500 LE80537UE0042M Benutzerhandbuch
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Produktcode
LE80537UE0042M
Datasheet
3
Contents
Introduction ..............................................................................................................7
1.1
1.1
Terminology .......................................................................................................9
Low Power Features ................................................................................................ 11
2.1
2.1
Clock Control and Low Power States .................................................................... 11
2.1.1
2.1.1
Core Low Power State Descriptions ........................................................... 13
Enhanced Intel SpeedStep® Technology .............................................................. 18
Electrical Specifications ........................................................................................... 21
3.1
3.1
Power and Ground Pins ...................................................................................... 21
FSB Clock (BCLK[1:0]) and Processor Clocking...................................................... 21
Voltage Identification ......................................................................................... 21
Reserved and Unused Pins.................................................................................. 25
FSB Signal Groups............................................................................................. 26
CMOS Signals ................................................................................................... 28
Maximum Ratings.............................................................................................. 28
3.10 Processor DC Specifications ................................................................................ 29
Package Mechanical Specifications and Pin Information .......................................... 39
4.1
4.1
Alphabetical Signals Reference ............................................................................ 73
Thermal Specifications and Design Considerations .................................................. 81
5.1
5.1
Thermal Specifications ....................................................................................... 85
5.1.1
5.1.1
Thermal Diode ....................................................................................... 85
Intel® Thermal Monitor........................................................................... 87