BenutzerhandbuchInhaltsverzeichnis1. General description12. Features13. Applications14. Quick reference data25. Ordering information26. Block diagram37. Pinning information47.1 Pinning47.2 Pin description48. Functional description58.1 General58.2 Mode selection and interfacing68.3 Pulse width modulation frequency78.4 Protection88.4.1 Thermal Foldback (TF)98.4.2 OverTemperature Protection (OTP)98.4.3 OverCurrent Protection (OCP)98.4.4 Window Protection (WP)98.4.5 Supply voltage protection108.5 Diagnostic input and output118.6 Differential inputs118.7 Output voltage buffers119. Internal circuitry1210. Limiting values1611. Thermal characteristics1612. Static characteristics1713. Dynamic characteristics1914. Application information2214.1 Output power estimation2214.2 Output current limiting2414.3 Speaker configuration and impedance2414.4 Single-ended capacitor2414.5 Gain reduction2514.6 Device synchronization2614.7 Thermal behavior (printed-circuit board considerations)2614.8 Pumping effects2714.9 SE curves measured in reference design2914.10 BTL curves measured in reference design3314.11 Typical application schematics (simplified)3715. Test information4015.1 Quality information4016. Package outline4117. Soldering4317.1 Introduction to soldering4317.2 Wave and reflow soldering4317.3 Wave soldering4317.4 Reflow soldering4418. Abbreviations4519. Revision history4620. Legal information4720.1 Data sheet status4720.2 Definitions4720.3 Disclaimers4720.4 Trademarks4721. Contact information4722. Contents48Größe: 316 KBSeiten: 48Language: EnglishHandbuch öffnen
BenutzerhandbuchInhaltsverzeichnis1. General description12. Features13. Applications14. Quick reference data25. Ordering information26. Block diagram37. Pinning information47.1 Pinning47.2 Pin description48. Functional description58.1 General58.2 Mode selection and interfacing68.3 Pulse width modulation frequency78.4 Protection88.4.1 Thermal Foldback (TF)98.4.2 OverTemperature Protection (OTP)98.4.3 OverCurrent Protection (OCP)98.4.4 Window Protection (WP)98.4.5 Supply voltage protection108.5 Diagnostic input and output118.6 Differential inputs118.7 Output voltage buffers119. Internal circuitry1210. Limiting values1611. Thermal characteristics1612. Static characteristics1713. Dynamic characteristics1914. Application information2214.1 Output power estimation2214.2 Output current limiting2414.3 Speaker configuration and impedance2414.4 Single-ended capacitor2414.5 Gain reduction2514.6 Device synchronization2614.7 Thermal behavior (printed-circuit board considerations)2614.8 Pumping effects2714.9 SE curves measured in reference design2914.10 BTL curves measured in reference design3314.11 Typical application schematics (simplified)3715. Test information4015.1 Quality information4016. Package outline4117. Soldering4317.1 Introduction to soldering4317.2 Wave and reflow soldering4317.3 Wave soldering4317.4 Reflow soldering4418. Abbreviations4519. Revision history4620. Legal information4720.1 Data sheet status4720.2 Definitions4720.3 Disclaimers4720.4 Trademarks4721. Contact information4722. Contents48Größe: 316 KBSeiten: 48Language: EnglishHandbuch öffnen
