Intel 200 User Manual

Thermal and Mechanical Design Guidelines 

 37 

This chapter will document the requirements for designing a passive heatsink that 

meets the maximum usage power consumption that mentioned in Section 2.4.  The 

Intel

®

 Boxed Processor thermal solution E21953-001 satisfies the specified thermal 

requirements.   

Note:  The part number E21953-001 provided in this document is for reference only.  The 

revision number -001 may be subject to change without notice.  OEMs and System 
Integrators are responsible for thermal, mechanical and environmental validation of 
this solution (refer to Sections 4.1.2 and 4.2). 

The Intel

®

 Boxed Processor thermal solution E21953-001 takes advantage of cost 

savings.  The thermal solution supports the unique and smaller desktop PCs including 

small and ultra small form factors, down to a 5L system size.  

The motherboard keep-out and height recommendations shown in Section 2.1 remain 

the same for a thermal solution for the Intel Celeron processor 200 sequence in the 

micro-FCBGA package.  

Many companies design products that must function reliably at high altitude, typically 

1,500 m [5,000 ft] or more.  Air-cooled temperature calculations and measurements 

at the test site elevation must be adjusted to take into account altitude effects like 

variation in air density and overall heat capacity.  This often leads to some 

degradation in thermal solution performance compared to what is obtained at sea 

level, with lower fan performance and higher surface temperatures.  The system 

designer needs to account for altitude effects in the overall system thermal design to 

make sure that the T

S-TOP-MAX

 requirement for the processor is met at the targeted 

altitude. 

Intel recommends evaluation of the heatsink within the specific boundary conditions 

based on the methodology described in Chapter 3.     

Testing is done on bench top test boards at ambient laboratory temperature.   

The test results, for a number of samples, are reported in terms of a worst-case mean 

+ 3σ value for thermal characterization parameter using real processors.