Intel Xeon 7130N LF80550KF0878M Data Sheet
Product codes
LF80550KF0878M
Thermal Specifications
72
Dual-Core Intel
®
Xeon
®
Processor 7000 Series Datasheet
6.2.4
FORCEPR# Signal Pin
The FORCEPR# (force power reduction) input can be used by the platform to force the Dual-Core
Intel Xeon processor 7000 series processor to activate the TCC. If the Thermal Monitor is enabled,
the TCC will be activated upon the assertion of the FORCEPR# signal. The TCC will remain active
until the system deasserts FORCEPR#. FORCEPR# is an asynchronous input. FORCEPR# can be
used to thermally protect other system components. To use the voltage regulator (VR) as an
example, when the FORCEPR# pin is asserted, the TCC in the processor will activate, reducing the
current consumption of the processor and the corresponding temperature of the VR.
Intel Xeon processor 7000 series processor to activate the TCC. If the Thermal Monitor is enabled,
the TCC will be activated upon the assertion of the FORCEPR# signal. The TCC will remain active
until the system deasserts FORCEPR#. FORCEPR# is an asynchronous input. FORCEPR# can be
used to thermally protect other system components. To use the voltage regulator (VR) as an
example, when the FORCEPR# pin is asserted, the TCC in the processor will activate, reducing the
current consumption of the processor and the corresponding temperature of the VR.
It should be noted that assertion of FORCEPR# does not automatically assert PROCHOT#. As
mentioned previously, the PROCHOT# signal is asserted when a high temperature situation is
detected. A minimum pulse width of 500 microseconds is recommended when FORCEPR# is
asserted by the system. Sustained activation of the FORCEPR# pin may cause noticeable platform
performance degradation.
mentioned previously, the PROCHOT# signal is asserted when a high temperature situation is
detected. A minimum pulse width of 500 microseconds is recommended when FORCEPR# is
asserted by the system. Sustained activation of the FORCEPR# pin may cause noticeable platform
performance degradation.
Refer to the appropriate platform design guide for details on implementing the FORCEPR# signal
feature.
feature.
6.2.5
THERMTRIP# Signal Pin
Regardless of whether or not Thermal Monitor is enabled, in the event of a catastrophic cooling
failure, the processor will automatically shut down when the silicon has reached an elevated
temperature (refer to the THERMTRIP# definition in
failure, the processor will automatically shut down when the silicon has reached an elevated
temperature (refer to the THERMTRIP# definition in
). At this point, the system bus
signal THERMTRIP# will go active and stay active as described in
activation is independent of processor activity and does not generate any bus cycles. Intel also
recommends removal of V
recommends removal of V
TT
.
6.2.6
Tcontrol and Fan Speed Reduction
Tcontrol is a temperature specification based on a temperature reading from the thermal diode. The
value for Tcontrol will be calibrated in manufacturing and configured for each processor. The
Tcontrol temperature for a given processor can be obtained by reading the
IA32_TEMPERATURE_TARGET MSR in the processor. The Tcontrol value that is read from the
IA32_TEMPERATURE_TARGET MSR must be converted from Hexadecimal to Decimal and
added to a base value of 50
value for Tcontrol will be calibrated in manufacturing and configured for each processor. The
Tcontrol temperature for a given processor can be obtained by reading the
IA32_TEMPERATURE_TARGET MSR in the processor. The Tcontrol value that is read from the
IA32_TEMPERATURE_TARGET MSR must be converted from Hexadecimal to Decimal and
added to a base value of 50
°
C.
The value of Tcontrol may vary from 0x00h to 0x1Eh. Refer to the Prescott, Nocona and Potomac
Processor BIOS Writer’s Guide (BWG) for specific register details.
Processor BIOS Writer’s Guide (BWG) for specific register details.
When Tdiode is above Tcontrol, then T
CASE
must be at or below T
CASE_MAX
as defined by the
thermal profile (see
). Otherwise, the processor temperature can be
maintained at Tcontrol.
6.2.7
Thermal Diode
The processor incorporates an thermal diode on each processor core. A thermal sensor located on
the processor package monitors the die temperature of each core for thermal management/long
term die temperature change purposes. The thermal diode is separate from the Thermal Monitor’s
thermal sensor and cannot be used to predict the behavior of the Thermal Monitor.
the processor package monitors the die temperature of each core for thermal management/long
term die temperature change purposes. The thermal diode is separate from the Thermal Monitor’s
thermal sensor and cannot be used to predict the behavior of the Thermal Monitor.
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