Intel L7345 LF80565JH0368M Data Sheet

96

Document Number: 318080-002

Additionally, utilization of a thermal solution that does not meet the Thermal Profile will 
violate the thermal specifications and may result in permanent damage to the 
processor. Refer to the Dual-Core Intel® Xeon® Processor 7200 Series  and Quad-
Core Intel® Xeon® Processor 7300 Series Thermal / Mechanical Design Guide for 
details on system thermal solution design, thermal profiles and environmental 
considerations.

For the Quad-Core Intel® Xeon® X7350 Processor, Intel has developed a thermal 
profile which must be met to ensure adherence to Intel reliability requirements. The 
Thermal Profile (see 

; 

) is representative of a volumetrically 

unconstrained thermal solution (that is, industry enabled 2U heatsink). In this scenario, 
it is expected that the Thermal Control Circuit (TCC) would only be activated for very 
brief periods of time when running the most power intensive applications. Intel has 
developed the thermal profile to allow customers to choose the thermal solution and 
environmental parameters that best suit their platform implementation. Refer to the 
Dual-Core Intel® Xeon® Processor 7200 Series  and Quad-Core Intel® Xeon® 
Processor 7300 Series Thermal / Mechanical Design Guide for details on system 
thermal solution design, thermal profiles and environmental considerations.

The upper point of the thermal profile consists of the Thermal Design Power (TDP) and 
the associated T

CASE

 value. It should be noted that the upper point associated with 

Quad-Core Intel® Xeon® X7350 Processor Thermal Profile (x = TDP and y = T

CASE_MAX

 

P @ TDP) represents a thermal solution design point. In actuality the processor case 
temperature will not reach this value due to TCC activation (see 

 for Quad-

Core Intel® Xeon® X7350 Processor).

Analysis indicates that real applications are unlikely to cause the processor to consume 
maximum power dissipation for sustained time periods. Intel recommends that 
complete thermal solution designs target the Thermal Design Power (TDP) instead of 
the maximum processor power consumption. The Thermal Monitor feature is intended 
to help protect the processor in the event that an application exceeds the TDP 
recommendation for a sustained time period. For more details on this feature, refer to 

. To ensure maximum flexibility for future requirements, systems should be 

designed to the Flexible Motherboard (FMB) guidelines, even if a processor with lower 
power dissipation is currently planned. Thermal Monitor and Thermal Monitor 2 
feature must be enabled for the processor to remain within its specifications. 

1.

These values are specified at V

CC_MAX

 for all processor frequencies. Systems must be designed to ensure 

the processor is not to be subjected to any static V

CC

 and I

CC

 combination wherein V

CC

 exceeds V

CC_MAX

 at 

specified I

CC

. Please refer to the loadline specifications in 

.

2.

Maximum Power is the highest power the processor will dissipate, regardless of its VID. Maximum Power is 

measured at maximum T

CASE

.

3.

Thermal Design Power (TDP) should be used for processor thermal solution design targets. TDP is not the 

maximum power that the processor can dissipate. TDP is measured at maximum T

CASE

.

4.

These specifications are based on pre-silicon estimates and simulations. These specifications will be 

updated with characterized data from silicon measurements in a future release of this document.

5.

Power specifications are defined at all VIDs found in 

. The Quad-Core Intel® Xeon® E7300 

Processor may be shipped under multiple VIDs for each frequency.

6.

FMB, or Flexible Motherboard, guidelines provide a design target for meeting all planned processor 

frequency requirements. 

Launch to FMB

80

5

See 

;

1, 2, 3, 4, 5, 6