Nokia 6560 Service Manual
RH-25
System Module
CCS Technical Documentation
Page 4
©Nokia Corporation Confidential
Issue 1 10/2003
Introduction
This document describes the system module for the RH-25 transceiver. The baseband
module includes the baseband engine chipset, the UI components, and the acoustic com-
ponents. RH-25 is a hand-portable dual band TDMA 850/1900 with AMPS. It has been
designed using DCT4 generation baseband (UEM/UPP) and RF (TACO) module. The base-
band module has been developed as part of the DCT4 common Baseband. RH-25 con-
tains some baseband features that are new to the America's TDMA market. These
features include stereo FM receiver (offered as an accessory) and a MIDI (polyphonic
ringing tones). The battery for RH-25 is the BLD-3 with a nominal capacity of 780 mAh.
module includes the baseband engine chipset, the UI components, and the acoustic com-
ponents. RH-25 is a hand-portable dual band TDMA 850/1900 with AMPS. It has been
designed using DCT4 generation baseband (UEM/UPP) and RF (TACO) module. The base-
band module has been developed as part of the DCT4 common Baseband. RH-25 con-
tains some baseband features that are new to the America's TDMA market. These
features include stereo FM receiver (offered as an accessory) and a MIDI (polyphonic
ringing tones). The battery for RH-25 is the BLD-3 with a nominal capacity of 780 mAh.
BB Hardware Characteristics
• Hi-Resolution (128x128) illuminated color display
• Active LCD pixel area: width 27.6mm X height 27.6mm
• ESD-proof keymat, with five individual keys for multiple key pressing
• Support for internal semi-fixed battery (Janette type BLD-3)
• Audio amplifier and SALT speaker for MIDI support
• Ringing volume 100dB @ 5cm (MIDI tones through SALT speaker)
• Stereo FM receiver as an accessory
• IrDa port/interface
• Internal vibra
• Supports voice dial activation via headset button
• Six white LEDs for keymat on UI board and two for LCD backlight in LCD module
• 6-layer PWB, SMD with components on both sides of PWB
Technical Summary
The baseband module is implemented using two main ASICs — the Universal Energy
Management (UEM) and the Universal Phone Processor (UPP). For detailed information
on these two ASICs, see the following documents: UEM ASIC Specification, UPP8M_V1
ASIC Specification. The baseband module also contains an audio amplifier for MIDI sup-
port and a 64-Mbit Flash/ 4-Mbit SRAM combo IC. EMC shielding is implemented using a
metallized plastic frame. On the other side, the engine is shielded with PWB ground
openings. Heat generated by the circuitry will be conducted out via the PWB ground
planes. The RH-25 transceiver module is implemented on six layer FR-4 material PWB.
Management (UEM) and the Universal Phone Processor (UPP). For detailed information
on these two ASICs, see the following documents: UEM ASIC Specification, UPP8M_V1
ASIC Specification. The baseband module also contains an audio amplifier for MIDI sup-
port and a 64-Mbit Flash/ 4-Mbit SRAM combo IC. EMC shielding is implemented using a
metallized plastic frame. On the other side, the engine is shielded with PWB ground
openings. Heat generated by the circuitry will be conducted out via the PWB ground
planes. The RH-25 transceiver module is implemented on six layer FR-4 material PWB.
Figure 1 shows a high level BB block diagram for RH-25 phone.