Nokia 6220 Service Manual

Page of 56
RH-20
Company confidential
System Module and User Interface
CCS Technical Documentation
Page 30
  Nokia Corporation.
Issue 1  10/2003
Camera
CIF camera module will be used in RH-20. Camera is connected to baseband (UPP) 
through HW accelerator IC. External 1.8V regulator is used as a power supply (VDIG) for 
camera module and HW accelerator together with VFLASH2.
Figure 7: Camera connections to baseband
CIF camera has a resolution of 352 x 288. Pixel size is 5.6um x 5.6um. Both camera and 
HW accelerator support sleep functionality in order to minimize the current consump-
tion.
IR Module
The IR interface when using transceiver with 1.8V I/O is designed into the UPP. The IR 
link supports speeds from 9600 bit/s to 1.152 MBit/s up to distance of 80 cm. Transmis-
sion over the IR if half-duplex.
SIM Interface
UEM contains the SIM interface logic level shifting. SIM interface can be programmed to 
support 3V and 1.8V SIMs. SIM supply voltage is selected by a register in the UEM. It is 
only allowed to change the SIM supply voltage when the SIM IF is powered down.
The SIM power up/down sequence is generated in the UEM. This means that the UEM 
generates the RST signal to the SIM. Also the SIMCardDet signal is connected to UEM. 
The card detection is taken from the BSI signal, which detects the removal of the battery. 
 
VDIG VFLASH2
VFLASH2
UPP 
CamSDX 
LCDCamClk 
CamClk 
LCDCamTxDa 
CamCSX 
CamRxDa 
GenIO(27) 
GenIO(28) 
GenIO(26)
GenIO(3) 
LCDUI(0) 
LCDUI(1) 
HW 
Accelerator
Camera 
CCISCL 
CCIDA 
CCPCLKN 
CCPCLKP 
CCPDATAN 
CCPDATAP 
VDIG