Nxp Semiconductors PIP3107-D User Manual
Philips Semiconductors
Product specification
Logic level TOPFET
PIP3107-D
MECHANICAL DATA
Fig.2. SOT428 surface mounting package
1
, centre pin connected to mounting base.
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
EIAJ
SOT428
98-04-07
0
10
20 mm
scale
Plastic single-ended surface mounted package (Philips version of D-PAK); 3 leads
(one lead cropped)
(one lead cropped)
SOT428
E
b2
D1
w
A
M
b
c
b1
L1
L
1
3
2
D
E1
HE
L2
Note
1. Measured from heatsink back to lead.
e1
e
A
A2
A
A1
y
seating plane
mounting
base
A1
(1)
D
max.
b
D1
max.
E
max.
HE
max.
w
y
max.
A2
b2
b1
max.
c
E1
min.
e
e1
L1
min.
L2
L
A
max.
UNIT
DIMENSIONS (mm are the original dimensions)
0.2
0.2
mm
2.38
2.22
2.22
0.65
0.45
0.45
0.89
0.71
0.71
0.89
0.71
0.71
1.1
0.9
0.9
5.36
5.26
5.26
0.4
0.2
0.2
6.22
5.98
5.98
4.81
4.45
4.45
2.285
4.57
10.4
9.6
0.5
0.7
0.5
0.5
6.73
6.47
6.47
4.0
2.95
2.55
2.55
1 Epoxy meets UL94 V0 at 1/8". Net mass: 1.1 g
For soldering guidelines and SMD footprint design, please refer to Data Handbook SC18.
October 2001
5
Rev 1.000