Intel DQ57TML BLKDQ57TML User Manual

Product codes
BLKDQ57TML
Page of 4
PRocESSoR 
Processor Support 
• Intel® Core™ i7 and Intel® Core™ i5 processors
 in the LGA1156 package
• Supports Intel® 64 architecture
4
cHIPSET
Intel® Q57 Express chipset
• Intel® 82Q57 Platform Controller Hub (PCH)
Integrated Intel® PcH controllers
• Four ports accessible via back panel
• Eight additional ports via internal ports
• Four SATA ports
System BIoS
• 64 Mb Flash EEPROM with Intel® Platform
 Innovation Framework for EFI Plug and Play,
 IDE drive auto-configure
• Advanced configuration and power interface V1.0b,
 DMI 2.0, multilingual support
• Intel® Express BIOS Update support
SYSTEM MEMoRY
Memory capacity
• Four 240-pin DIMM connectors supporting up to
 four double-sided DIMMs
Memory Types 
• DDR3 1333 / 1066 SDRAM memory support
• Non-ECC Memory
For ordering information, visit www.intel.com
For a complete list of solutions and opportunities, visit 
www.intel.com/go/upgradesreseller or www.intel.com/go/idb
 
1
Use of Intel® vPro™ technology requires a supported Intel® processor.
 
2
System resources and hardware (such as PCI and PCI Express*) require physical memory address locations that can reduce available addressable system memory. This could result in a reduction of as much 
as 1 GB or more of physical addressable memory being available to the operating system and applications, depending on the system configuration and operating system.
 
3
Intel® High Definition Audio requires a system with an appropriate Intel® chipset and a motherboard with an appropriate codec and the necessary drivers installed. System sound quality will vary depending 
on actual implementation, controller, codec, drivers, and speakers. For more information about Intel® HD Audio, refer to www.intel.com/design/chipsets/hdaudio.htm
 4
64-bit computing on Intel® architecture requires a computer system with a processor, chipset, BIOS, operating system, device drivers, and applications enabled for Intel® 64 architecture. Processors will not
operate (including 32-bit operation) without an Intel 64 architecture-enabled BIOS. Performance will vary depending on your hardware and software configurations. See http://developer.intel.com/technology/
intel64/index.htm for more information.
  INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS
GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS
OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR
INFRINGEMENT OF ANY PATENT, COPYRIGHT, OR OTHER INTELLECTUAL PROPERTY RIGHT.
  Intel products are not intended for use in medical, life-saving, or life-sustaining applications. Intel may make changes to specifications and product descriptions at any time, without notice.
  All products, dates, and figures specified are preliminary based on current expectations, and are subject to change without notice. Availability in different channels may vary.
  Actual Intel® Desktop Board may differ from the image shown.
  Intel, the Intel logo, Intel vPro, Intel vPro Inside, Intel Core, and Core Inside are trademarks of Intel Corporation in the U.S. and other countries.
 * Other names and brands may be claimed as the property of others.
  Copyright © 2010 Intel Corporation. All rights reserved. 0610/TFC/MS/PDF 323934-001US
Intel® Desktop Board DQ57TML Executive Series 
Technical Specifications
Memory Modes
• Dual- or single-channel operation support
Memory Voltage
• 1.2 V to 1.7 V
Hardware Management features
• Processor fan speed monitor and control
• System chassis fan speed monitor and control
• Voltage and temperature sensing
Intel® 82567LM ENERGY STAR*-ready 
10/100/1000 Network connection
• New low-power design meets ENERGY STAR* 5.0
 specifications
Expansion capabilities
• One PCI bus add-in card connector
• One PCI Express* 2.0 x16 graphics connector
• Two PCI Express x1 add-in card connectors
Audio
• Six-channel Intel® High Definition Audio
3
codec
JUMPERS AND fRoNT-PANEL coNNEcToRS
Jumpers
• Jumper access for BIOS maintenance mode
front-Panel connectors
• Reset, HDD LED, Power LEDs, power on / off
• Front-panel Hi-Speed USB 2.0 headers
• Front-panel audio header
MEcHANIcAL
Board Style
• MicroATX 2.2-compliant
Board Size
• 9.6” x 9.6” (24.38 cm x 24.38 cm)
Baseboard Power Requirements
• ATX 12 V
ENVIRoNMENT
operating Temperature
• 0° C to +55° C
Storage Temperature
• -20° C to +70° C
REGULATIoNS AND SAfETY STANDARDS
United States and canada
 CSA / UL 60950-1, First Edition (Binational Standard)
Europe 
 (Low Voltage Directive 2006 / 95 / EC)
 EN 60950-1:2006
International
 IEC 60950-1:2001, First Edition
EMc Regulations (tested in representative chassis)
United States
 FCC 47 CFR Part 15, Subpart B
canada
 ICES-003 Class B
Europe
 (EMC Directive 2004 / 108 / EC)
 EN 55022:2006 and EN 55024:1998
Australia / New Zealand
 EN 55022:2006 Class B
Japan
 VCCI V-3 / 04.04, V-4 / 03.04, Class B
South Korea
 KN-22:2005 and KN-24:2005
Taiwan
 CNS 13438:2006 Class B
International
 CISPR 22:2005 +A1:2005 +A2:2006 Class B
Environmental compliance
Europe
 Europe RoHS (Directive 2002 / 95 / EC)
china
 China RoHS (MII Order # 39)
Lead-free: The symbol is used to identify
electrical and electronic assemblies and
components in which the lead (Pb) concen-
tration level in any of the raw materials and the end
product is not greater than 0.1% by weight (1000 ppm).
This symbol is also used to indicate conformance
to lead-free requirements and definitions adopted
under the European Union’s Restriction on Hazardous
Substances (RoHS) directive, 2002 / 95 / EC.