Enermax ETS-T40-TA Leaflet
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World leading thermal resistance performance of 0.09°C/W
ENERMAX now goes even further into the CPU thermal solution
industry. The new CPU cooler, ETS-T40 series, combines
patented Vortex Generator Flow, Stack Effect, Heat Pipe Direct
Touch technologies, plus Vacuum Effect design and ENERMAX
renowned Twister Bearing fan. All together taking the thermal
resistance value down to an incredible 0.09°C/W, and removing
any hot spots on the CPU running at ultra-high speed, gives the
CPU the most reliable computing cooling performance.
ENERMAX now goes even further into the CPU thermal solution
industry. The new CPU cooler, ETS-T40 series, combines
patented Vortex Generator Flow, Stack Effect, Heat Pipe Direct
Touch technologies, plus Vacuum Effect design and ENERMAX
renowned Twister Bearing fan. All together taking the thermal
resistance value down to an incredible 0.09°C/W, and removing
any hot spots on the CPU running at ultra-high speed, gives the
CPU the most reliable computing cooling performance.
200+W
Introduction
ETS-T40-TB
Features
1. World leading thermal resistance performance of 0.09°C/W.
- Patented VGF (Vortex generator flow) technology to greatly increase air convection.
- Patented SEF (Stack Effect) design to enhance heat transfer.
- Unique air path creating high VEF (Vacuum Effect) to optimize the airflow.
- Patented HDT (Heat Pipe Direct Touch) Technology to ensure rapid thermal conduction and eliminate CPU hotspot.
2. Side flow type with four Ø6mm high performance heat pipes.
3. Unique T.B.Silence PWM fan to adjust the power efficiently and keep the silence. (ETS-T40-TB only)
4. Patented circular type LED fan for the utmost eye-catching. (ETS-T40-TA & ETS-T40-VD only)
5. Nickel-plated heat sink to reduce oxidation effect and maintain the top performance. (ETS-T40-TA only)
6. Dual fan installed option and solid springs attached.
7. Anti-vibration rubbers prevent fan vibration and absorb noise.
8. Universal bracket for Intel
- Patented VGF (Vortex generator flow) technology to greatly increase air convection.
- Patented SEF (Stack Effect) design to enhance heat transfer.
- Unique air path creating high VEF (Vacuum Effect) to optimize the airflow.
- Patented HDT (Heat Pipe Direct Touch) Technology to ensure rapid thermal conduction and eliminate CPU hotspot.
2. Side flow type with four Ø6mm high performance heat pipes.
3. Unique T.B.Silence PWM fan to adjust the power efficiently and keep the silence. (ETS-T40-TB only)
4. Patented circular type LED fan for the utmost eye-catching. (ETS-T40-TA & ETS-T40-VD only)
5. Nickel-plated heat sink to reduce oxidation effect and maintain the top performance. (ETS-T40-TA only)
6. Dual fan installed option and solid springs attached.
7. Anti-vibration rubbers prevent fan vibration and absorb noise.
8. Universal bracket for Intel
®
775/1155/1156/1366/2011 and AMD
®
AM2/AM2+/AM3/AM3+/FM1.
9. High thermal conductivity grease to ensure the best thermal conduction between CPU and the heat sink.
Patented VGF/SEF/VEF design
Patented HDT design
4 pcs of Ø6mm heat pipes
120mm dual fan installed option
Two sets of solid springs
Universal bracket
PWM function fan
Application view
High thermal conductivity grease
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