Intel 1005M AW8063801121200 User Manual

Product codes
AW8063801121200
Page of 172
Interfaces 
30
Datasheet, Volume 1
2.1.8
DDR3 Reference Voltage Generation
The processor memory controller has the capability of generating the DDR3 Reference 
Voltage (VREF) internally for both read (RDVREF) and write (VREFDQ) operations. The 
generated VREF can be changed in small steps, and an optimum VREF value is 
determined for both during a cold boot through advanced DDR3 training procedures in 
order to provide the best voltage and signal margins.
2.2
PCI Express* Interface
This section describes the PCI Express interface capabilities of the processor. See the 
PCI Express Base Specification for details of PCI Express.
The processor has one PCI Express controller that can support one external x16 PCI 
Express Graphics Device. The primary PCI Express Graphics port is referred to as 
PEG
 0.
2.2.1
PCI Express* Architecture
Compatibility with the PCI addressing model is maintained to ensure that all existing 
applications and drivers may operate unchanged.
The PCI Express configuration uses standard mechanisms as defined in the PCI 
Plug-and-Play specification. The processor external graphics ports support Gen 3 speed 
as well. At 8 GT/s, Gen 3 operation results in twice as much bandwidth per lane as 
compared to Gen 2 operation. The 16-lane PCI Express* graphics port can operate at 
either 2.5
 GT/s, 
5
 
GT/s, or 8
 GT/s. 
PCI Express* Gen 3 uses a 128/130b encoding scheme, eliminating nearly all of the 
overhead of the 8b/10b encoding scheme used in Gen 1 and Gen 2 operation.
The PCI Express architecture is specified in three layers – Transaction Layer, Data Link 
Layer, and Physical Layer. The partitioning in the component is not necessarily along 
these same boundaries. Refer to 
 for the PCI Express layering diagram.
Figure 2-2. PCI Express* Layering Diagram