Intel 1005M AW8063801121200 User Manual
Product codes
AW8063801121200
Datasheet, Volume 1
69
Thermal Management
5
Thermal Management
The thermal solution provides both the component-level and the system-level thermal
management. To allow for the optimal operation and long-term reliability of Intel
processor-based systems, the system/processor thermal solution should be designed
so that the processor:
management. To allow for the optimal operation and long-term reliability of Intel
processor-based systems, the system/processor thermal solution should be designed
so that the processor:
• Remains below the maximum junction temperature (T
j,Max
) specification at the
maximum thermal design power (TDP).
• Conforms to system constraints, such as system acoustics, system skin-
temperatures, and exhaust-temperature requirements.
Caution:
Thermal specifications given in this chapter are on the component and package level
and apply specifically to the processor. Operating the processor outside the specified
limits may result in permanent damage to the processor and potentially other
components in the system.
5.1
Thermal Considerations
The processor TDP is the maximum sustained power that should be used for design of
the processor thermal solution. TDP represents an expected maximum sustained power
from realistic applications. TDP may be exceeded for short periods of time or if running
a “power virus” workload.
the processor thermal solution. TDP represents an expected maximum sustained power
from realistic applications. TDP may be exceeded for short periods of time or if running
a “power virus” workload.
The processor integrates multiple CPU and graphics cores on a single die. This may
result in differences in the power distribution across the die and must be considered
when designing the thermal solution.
result in differences in the power distribution across the die and must be considered
when designing the thermal solution.
Intel Boost Technology allows processor cores and processor graphics cores to run
faster than the baseline frequency. It is invoked opportunistically and automatically as
long as the processor is conforming to its temperature, power delivery, and current
specification limits. When Intel Turbo Boost Technology is enabled:
faster than the baseline frequency. It is invoked opportunistically and automatically as
long as the processor is conforming to its temperature, power delivery, and current
specification limits. When Intel Turbo Boost Technology is enabled:
• Applications are expected to run closer to TDP more often as the processor will
attempt to maximize performance by taking advantage of available TDP headroom
in the processor package.
in the processor package.
• The processor may exceed the TDP for short durations to utilize any available
thermal capacitance within the thermal solution. The duration and time of such
operation can be limited by platform runtime configurable registers within the
processor.
operation can be limited by platform runtime configurable registers within the
processor.
• Thermal solutions and platform cooling that are designed to less than thermal
design guidance may experience thermal and performance issues since more
applications will tend to run at or near the maximum power limit for significant
periods of time.
applications will tend to run at or near the maximum power limit for significant
periods of time.