Intel Pentium D 830 HH80551PG0802MN Data Sheet

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This section describes the cooling requirements of the fan heatsink solution utilized by the boxed 
processor.

The boxed processor may be directly cooled with a fan heatsink. However, meeting the processor's 
temperature specification is also a function of the thermal design of the entire system, and 
ultimately the responsibility of the system integrator. The processor temperature specification is 
found in 

 of this document. The boxed processor fan heatsink is able to keep the 

processor temperature within the specifications (see 

) in chassis that provide good 

thermal management. For the boxed processor fan heatsink to operate properly, it is critical that the 
airflow provided to the fan heatsink is unimpeded. Airflow of the fan heatsink is into the center and 
out of the sides of the fan heatsink. Airspace is required around the fan to ensure that the airflow 
through the fan heatsink is not blocked. Blocking the airflow to the fan heatsink reduces the 
cooling efficiency and decreases fan life. 

 illustrate an acceptable 

airspace clearance for the fan heatsink. The air temperature entering the fan should be kept below 
39 ºC. A Thermally Advantaged Chassis with an Air Guide 1.1 is recommended to meet the 39 ºC 
requirement. Again, meeting the processor's temperature specification is the responsibility of the 
system integrator.

The processor fan is the primary source of airflow for cooling the V

CC

 voltage regulator. Dedicated 

voltage regulator cooling components may be necessary if the selected fan is not capable of 
keeping regulator components below maximum rated temperatures.