Fujitsu Xeon S26361-F3099-E828 Data Sheet
Product codes
S26361-F3099-E828
Intel® Xeon™ Processor with 800 MHz System Bus
Datasheet
11
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Demand-Based Switching (DBS) with Enhanced Intel SpeedStep® Technology —
Demand-Based Switching (DBS) with Enhanced Intel SpeedStep® Technology is the next
generation implementation of Geyserville technology which extends power management
capabilities of servers and workstations.
Demand-Based Switching (DBS) with Enhanced Intel SpeedStep® Technology is the next
generation implementation of Geyserville technology which extends power management
capabilities of servers and workstations.
•
Enterprise Voltage Regulator Down (EVRD) — DC-DC converter integrated onto the
system board that provide the correct voltage and current for the processor based on the logic
state of the VID bits.
system board that provide the correct voltage and current for the processor based on the logic
state of the VID bits.
•
Flip Chip Micro Pin Grid Array (FC-mPGA4) Package — The processor package is a Flip
Chip Micro Pin Grid Array (FC-mPGA4), consisting of a processor core mounted on a pinned
substrate with an integrated heat spreader (IHS). This package technology employs a 1.27 mm
[0.05 in.] pitch for the processor pins.
Chip Micro Pin Grid Array (FC-mPGA4), consisting of a processor core mounted on a pinned
substrate with an integrated heat spreader (IHS). This package technology employs a 1.27 mm
[0.05 in.] pitch for the processor pins.
•
Front Side Bus (FSB) — The electrical interface that connects the processor to the chipset.
Also referred to as the processor system bus or the system bus. All memory and I/O
transactions as well as interrupt messages pass between the processor and the chipset over the
FSB.
Also referred to as the processor system bus or the system bus. All memory and I/O
transactions as well as interrupt messages pass between the processor and the chipset over the
FSB.
•
Functional Operation — Refers to the normal operating conditions in which all processor
specifications, including DC, AC, system bus, signal quality, mechanical and thermal are
satisfied.
specifications, including DC, AC, system bus, signal quality, mechanical and thermal are
satisfied.
•
Integrated Heat Spreader (IHS) — A component of the processor package used to enhance
the thermal performance of the package. Component thermal solutions interface with the
processor at the IHS surface.
the thermal performance of the package. Component thermal solutions interface with the
processor at the IHS surface.
•
mPGA604 Socket — The Intel® Xeon™ processor with 800 MHz system bus mates with the
baseboard through this surface mount, 604-pin, zero insertion force (ZIF) socket. See the
mPGA604 Socket Design Guidelines for details regarding this socket.
baseboard through this surface mount, 604-pin, zero insertion force (ZIF) socket. See the
mPGA604 Socket Design Guidelines for details regarding this socket.
•
Processor Core — The processor’s execution engine.
•
Storage Conditions — Refers to a non-operational state. The processor may be installed in a
platform, in a tray, or loose. Processors may be sealed in packaging or exposed to free air.
Under these conditions, processor pins should not be connected to any supply voltages, have
any I/Os biased or receive any clocks.
platform, in a tray, or loose. Processors may be sealed in packaging or exposed to free air.
Under these conditions, processor pins should not be connected to any supply voltages, have
any I/Os biased or receive any clocks.
•
Symmetric Agent — A symmetric agent is a processor which shares the same I/O subsystem
and memory array, and runs the same operating system as another processor in a system.
Systems using symmetric agents are known as Symmetric Multiprocessor (SMP) systems.
Intel® Xeon™ processor with 800 MHz system bus should only be used in SMP systems
which have two or fewer agents.
and memory array, and runs the same operating system as another processor in a system.
Systems using symmetric agents are known as Symmetric Multiprocessor (SMP) systems.
Intel® Xeon™ processor with 800 MHz system bus should only be used in SMP systems
which have two or fewer agents.
•
Thermal Design Power — Processor/chipset thermal solution should be designed to this
target. It is the highest expected sustainable power while running known power-intensive real
applications. TDP is not the maximum power that the processor/chipset can dissipate.
target. It is the highest expected sustainable power while running known power-intensive real
applications. TDP is not the maximum power that the processor/chipset can dissipate.
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Voltage Regulator Module (VRM) — DC-DC converter built onto a module that interfaces
with an appropriate card edge socket that supplies the correct voltage and current to the
processor.
with an appropriate card edge socket that supplies the correct voltage and current to the
processor.
•
V
CC
— The processor core power supply.
•
V
SS
— The processor ground.
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V
TT
— The system bus termination voltage.