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Intel
Core™2 Duo Processor E8500 (6M Cache, 3.16 GHz, 1333 MHz FSB)
User Manual
Intel Core™2 Duo Processor E8500 (6M Cache, 3.16 GHz, 1333 MHz FSB) BX80570E8500A User Manual
Product codes
BX80570E8500A
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4
Thermal and Mechanical Design Guidelines
4.2.5
On-Demand Mode ...................................................................37
4.2.6
System Considerations.............................................................37
4.2.7
Operating System and Application Software Considerations ...........38
4.2.8
THERMTRIP# Signal.................................................................38
4.2.9
Cooling System Failure Warning ................................................38
4.2.10
Digital Thermal Sensor.............................................................38
4.2.11
Platform Environmental Control Interface (PECI)..........................39
5
Balanced Technology Extended (BTX) Thermal/Mechanical Design Information ........41
5.1
Overview of the BTX Reference Design ....................................................41
5.1.1
Target Heatsink Performance ....................................................41
5.1.2
Acoustics ...............................................................................42
5.1.3
Effective Fan Curve .................................................................43
5.1.4
Voltage Regulator Thermal Management.....................................44
5.1.5
Altitude..................................................................................45
5.1.6
Reference Heatsink Thermal Validation .......................................45
5.2
Environmental Reliability Testing ............................................................45
5.2.1
Structural Reliability Testing .....................................................45
5.2.1.1
Random Vibration Test Procedure................................45
5.2.1.2
Shock Test Procedure ................................................46
5.2.2
Power Cycling .........................................................................47
5.2.3
Recommended BIOS/CPU/Memory Test Procedures ......................48
5.3
Material and Recycling Requirements ......................................................48
5.4
Safety Requirements ............................................................................49
5.5
Geometric Envelope for Intel Reference BTX Thermal Module Assembly........49
5.6
Preload and TMA Stiffness .....................................................................50
5.6.1
Structural Design Strategy........................................................50
5.6.2
TMA Preload verse Stiffness ......................................................50
6
ATX Thermal/Mechanical Design Information.......................................................53
6.1
ATX Reference Design Requirements .......................................................53
6.2
Validation Results for Reference Design ...................................................55
6.2.1
Heatsink Performance ..............................................................55
6.2.2
Acoustics ...............................................................................56
6.2.3
Altitude..................................................................................56
6.2.4
Heatsink Thermal Validation .....................................................57
6.3
Environmental Reliability Testing ............................................................57
6.3.1
Structural Reliability Testing .....................................................57
6.3.1.1
Random Vibration Test Procedure................................57
6.3.1.2
Shock Test Procedure ................................................58
6.3.2
Power Cycling .........................................................................59
6.3.3
Recommended BIOS/CPU/Memory Test Procedures ......................60
6.4
Material and Recycling Requirements ......................................................60
6.5
Safety Requirements ............................................................................61
6.6
Geometric Envelope for Intel Reference ATX Thermal Mechanical Design ......61
6.7
Reference Attach Mechanism..................................................................62
6.7.1
Structural Design Strategy........................................................62
6.7.2
Mechanical Interface to the Reference Attach Mechanism ..............63
7
Intel
®
Quiet System Technology (Intel
®
QST) .....................................................65
7.1
Intel
®
QST Algorithm ............................................................................65
7.1.1
Output Weighting Matrix ..........................................................66
7.1.2
Proportional-Integral-Derivative (PID) ........................................66
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