STMicroelectronics LM2904N Linear IC DIP8 Dual bip. op. amp. LM2904N Data Sheet
Product codes
LM2904N
LM2904
Package Mechanical Data
11/15
4
Package Mechanical Data
In order to meet environmental requirements, ST offers these devices in ECOPACK
®
packages.
These packages have a Lead-free second level interconnect. The category of second level
interconnect is marked on the package and on the inner box label, in compliance with JEDEC
Standard JESD97. The maximum ratings related to soldering conditions are also marked on
the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at:
interconnect is marked on the package and on the inner box label, in compliance with JEDEC
Standard JESD97. The maximum ratings related to soldering conditions are also marked on
the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at:
www.st.com
.
4.1
DIP8 Package
DIM.
mm.
inch
MIN.
TYP
MAX.
MIN.
TYP.
MAX.
A
3.3
0.130
a1
0.7
0.028
B
1.39
1.65
0.055
0.065
B1
0.91
1.04
0.036
0.041
b
0.5
0.020
b1
0.38
0.5
0.015
0.020
D
9.8
0.386
E
8.8
0.346
e
2.54
0.100
e3
7.62
0.300
e4
7.62
0.300
F
7.1
0.280
I
4.8
0.189
L
3.3
0.130
Z
0.44
1.6
0.017
0.063
Plastic DIP-8 MECHANICAL DATA
P001F