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STMicroelectronics TRANSIL 600W 100V SM6T100CA DO-214AA STM SM6T100CA Data Sheet

Product codes
SM6T100CA
Download
Page of 10
SM6T
Characteristics
Doc ID 3082 Rev 9
5/10
   
   
   
         
         
         
         
Figure 6.
Capacitance versus reverse 
applied voltage for unidirectional 
types (typical values)
Figure 7.
Capacitance versus reverse applied 
voltage for bidirectional types 
(typical values)
C (pF)
10
100
1000
10000
1
10
100
1000
F=1 MHz
V
osc
=30 mV
RMS
T
j
=25 °C
SM6T6V8A
SM6T15A
SM6T30A
SM6T68A
SM6T100A
SM6T220A
V
(V)
R
C (pF)
10
100
1000
10000
1
10
100
1000
F=1 MHz
V
osc
=30 mV
RMS
T
j
=25 °C
SM6T6V8CA
SM6T15CA
SM6T30CA
SM6T68CA
SM6T100CA
SM6T220CA
V
(V)
R
Figure 8.
Peak forward voltage drop versus 
peak forward current 
(typical values)
Figure 9.
Relative variation of thermal 
impedance junction to ambient 
versus pulse duration 
1.0E-02
1.0E-01
1.0E+00
1.0E+01
1.0E+02
0.0
0.5
1.0
1.5
2.0
2.5
3.0
I
FM
(A)
T
j
=25 °C
T
j
=125 °C
V
FM
(V)
Zth (j-a)/Rth (j-a)
0.01
0.10
1.00
1.0E-03
1.0E-02
1.0E-01
1.0E+00
1.0E+01
1.0E+02
1.0E+03
Recommended pad layout
Printed circuit board FR4, copper thickness = 35 µm
s
tp
Figure 10.
Thermal resistance junction to 
ambient versus copper surface 
under each lead
Figure 11.
Leakage current versus junction 
temperature (typical values)
0
10
20
30
40
50
60
70
80
90
100
110
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
R
th(j-a)
(°C/W)
(printed circuit board FR4,
copper thickness = 35 µm)
S
Cu
(cm²)
I
R
(nA)
1.E-01
1.E+00
1.E+01
1.E+02
1.E+03
25
50
75
100
125
150
V
R
=V
RM
V
RM
≥ 10 V
V
R
=V
RM
V
RM
< 10 V
T (° C)
j