Texas Instruments TPS62366AEVM-757 Evaluation Module TPS62366AEVM-757 TPS62366AEVM-757 Data Sheet
Product codes
TPS62366AEVM-757
T
I
EXAS
NSTRUMENTS
Board Layout
6
Board Layout
This section provides the TPS62366AEVM-757 board layout and illustrations.
Board layout is critical for all high-frequency, switch-mode power supplies.
through
show the board layout for the TPS62366AEVM-757 PCB. The nodes with high-switching frequencies and
currents are kept as short as possible to minimize trace inductance. Careful attention has been given to
the routing of high-frequency current loops and a single-point grounding scheme is used. Also, the
majority of the heatsinking for this device occurs through the top layer traces and vias pulled from the IC's
solder bumps that carry high currents. See the data sheet for specific layout guidelines.
currents are kept as short as possible to minimize trace inductance. Careful attention has been given to
the routing of high-frequency current loops and a single-point grounding scheme is used. Also, the
majority of the heatsinking for this device occurs through the top layer traces and vias pulled from the IC's
solder bumps that carry high currents. See the data sheet for specific layout guidelines.
Figure 12. Assembly Layer
15
SLVU690 – April 2012
TPS62366AEVM-757
Copyright © 2012, Texas Instruments Incorporated