Intel Desktop Board DP43TF, Sockel 775, DDR2, PCIe, ATX BOXDP43TF User Manual

Product codes

BOXDP43TF

System resources and hardware (such as PCI and PCI Express*) require physical memory address locations that can reduce available addressable system memory. This could

result in a reduction of as much as 1 GB or more of physical addressable memory being available to the operating system and applications, depending on the system configuration

and operating system.

64-bit computing on Intel® architecture requires a computer system with a processor, chipset, BIOS, operating system, device drivers and applications enabled for Intel® 64

architecture. Processors will not operate (including 32-bit operation) without an Intel 64 architecture-enabled BIOS. Performance will vary depending on your hardware and

software configurations. See http://developer.intel.com/technology/intel64/index.htm for more information.
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Technical Specifications

Processor

Processor Support

• Intel® Core™2 Quad** processor in the LGA775

package

• Intel® Core™2 Duo processor in the LGA775

package

• Intel® Pentium® Dual-Core processor in the

LGA775 package

• Intel® Celeron® Dual-Core processor in the

LGA775 package

• Intel® Celeron® processor 400 sequence in the

LGA775 package

• Supports Intel® 64 Architecture

Chipset

Intel® G43 Express Chipset (DG43NB)

or Intel® P43 Express Chipset (DP43TF)

• Intel® 82G43 Graphics and Memory Controller

Hub (GMCH) (DG43NB)

Intel® 82P43 Memory Controller Hub (MCH)

(DP43TF)

• Intel® 82801JB I/O Controller Hub (ICH10)
Graphics Memory Controller Hub (GMCH)

or Memory Controller Hub (MCH)

• Designed to support up to 4 GB

(DG43NB)

and 8 GB

(DP43TF) of system memory

using DDR2 800 / 667 SDRAM memory

• Intel® Fast Memory Access

• Intel® Graphics Media Accelerator X4500

with Intel® Clear Video Technology (DG43NB)
Intel® I/O Controller Hub (ICH)

• Six SATA (3.0 Gb/s) ports

• Intel® PRO 10/100/1000 network connection

• Twelve Hi-Speed USB 2.0 ports (six back panel

ports and an additional six USB ports via three

internal headers)

System BIOS

• 32 Mb Flash EEPROM with Intel® Platform

Innovation Framework for EFI Plug and Play,

IDE drive auto-configure

• Advanced configuration and power interface

V1.0b, DMI 2.0, multilingual support

• Serial Peripheral Interface (SPI) Flash
Intel® Rapid BIOS Boot

• Optimized POST for faster access to PC from

power-on

System Memory

Memory Capacity

• Two 240-pin DIMM connectors supporting

up to two double-sided DIMMs (DG43NB)

• Four 240-pin DIMM connectors supporting

up to four double-sided DIMMs (DP43TF)
Memory Types

• DDR2 800 / 667 SDRAM memory support

• Non-ECC Memory
Memory Modes

• Dual- or single-channel operation support
Memory Voltage

• 1.8 V
Hardware Management Features

• Processor fan speed control

• System chassis fan speed control

• Voltage and temperature sensing

• Fan sensor inputs used to monitor fan activity

• Power management support for ACPI 1.0b
High-Performance Intel® 82567V Gigabit

Network Connections

• High quality and reliability with Intel’s

world-class manufacturing and validation

Expansion Capabilities

• Three PCI bus add-in card connectors

• Three PCI Express* x1 bus add-in card

connectors

• One PCI Express 2.0 x16 graphics connector

• Ultra ATA 100 / 66 devices

Jumpers and Front-Panel Connectors

Jumpers

• Single configuration jumper design

• Jumper access for BIOS maintenance mode
Front-Panel Connectors

• Reset, HDD LED, Power LEDs, power on/off

• Three front-panel Hi-Speed USB 2.0 headers

• One 1394a header

• Front-panel audio header

• One serial header

Mechanical

Board Style

• ATX 2.2-compliant
Board Size

• 11.6” x 9.6” (29.46 cm x 24.38 cm)
Baseboard Power Requirements

• ATX12V

Environment

Operating Temperature

• 0° C to +55° C
Storage Temperature

• -20° C to +70° C

Regulations and Safety Standards

United States and Canada

CSA/UL 60950-1, First Edition

(Binational Standard)

Europe

(Low Voltage Directive 2006/95/EC)

EN 60950-1:2006

International

IEC 60950-1:2001, First Edition

EMC Regulations

(tested in representative chassis)

United States

FCC 47 CFR Part 15, Subpart B

Canada

ICES-003 Class B

Europe

(EMC Directive 2004/108/EC)

EN 55022:2006 and EN 55024:1998

Australia/New Zealand

EN 55022:2006 Class B

Japan

VCCI V-3/04.04, V-4/03.04, Class B

South Korea

KN-22:2005 and KN-24:2005

Taiwan

CNS 13438:2006 Class B

International

CISPR 22:2005 +A1:2005 +A2:2006 Class B
Environmental Compliance

Europe

Europe RoHS (Directive 2002/95/EC)

China

China RoHS (MII Order # 39)

Lead-Free: The symbol is used to

identify electrical and electronic

assemblies and components in which

the lead (Pb) concentration level in any

of the raw materials and the end product is not

greater than 0.1% by weight (1000 ppm). This

symbol is also used to indicate conformance to

lead-free requirements and definitions adopted

under the European Union’s Restriction on Haz-

ardous Substances (RoHS) directive, 2002/95/EC.

Ordering Information: See the Intel
Web site at www.intel.com. For the
most current product information,
visit developer.intel.com/design/
motherbd/