Atmel Xplained Pro Evaluation Kit ATSAM4E-XPRO ATSAM4E-XPRO Data Sheet

Product codes
ATSAM4E-XPRO
Page of 1506
1473
SAM4E [DATASHEET]
Atmel-11157D-ATARM-SAM4E16-SAM4E8-Datasheet_12-Jun-14
48.5
Soldering Profile 
 gives the recommended soldering profile from J-STD-020C.
Note:
The package is certified to be backward compatible with Pb/Sn soldering profile.
A maximum of three reflow passes is allowed per component.
48.6
Packaging Resources
Land Pattern Definition.
Refer to the following IPC Standards:
IPC-7351A and IPC-782 (Generic Requirements for Surface Mount Design and Land Pattern Standards
Atmel Green and RoHS Policy and Package Material Declaration Data Sheet 
Table 48-13.
Soldering Profile
Profile Feature
Green Package
Average Ramp-up Rate (217°C to Peak)
3
°C/sec. max.
Preheat Temperature 175°C ±25°C
180 sec. max.
Temperature Maintained Above 217°C
60 sec. to 150 sec.
Time within 5
°C of Actual Peak Temperature
20 sec. to 40 sec.
Peak Temperature Range
260
°C
Ramp-down Rate
6
°C/sec. max.
Time 25
°C to Peak Temperature
8 min. max.