Atmel Evaluation Kit AT91SAM9G25-EK AT91SAM9G25-EK Data Sheet
Product codes
AT91SAM9G25-EK
1139
SAM9G25 [DATASHEET]
11032D–ATARM–10-Mar-2014
47.2.2 247-ball VFBGA package
Figure 47-3. 247-ball VFBGA Package Drawing
Table 47-11. Package Information
BGA Substrate Ball Land
0.25 mm +/- 0.05
Solder Mask Opening
0.275 mm +/- 0.05
Table 47-12. Device and 247-ball BGA Package Maximum Weight
177
mg
Table 47-13. 247-ball BGA Package Characteristics
Moisture Sensitivity Level
3
Table 47-14. Package Reference
JEDEC Drawing Reference
none
JESD97 Classification
e8
Table 47-10. Ball Information
Ball Pitch
0.5 mm +/- 0.05
Ball Diameter
0.3 mm +/- 0.05