Atmel ARM-Based Evaluation Kit for SAM4S16C, 32-Bit ARM® Cortex® Microcontroller ATSAM4S-WPIR-RD ATSAM4S-WPIR-RD Data Sheet
Product codes
ATSAM4S-WPIR-RD
1185
SAM4S Series [DATASHEET]
Atmel-11100G-ATARM-SAM4S-Datasheet_27-May-14
Figure 45-2.
100-ball TFBGA Package Drawing
This package respects the recommendations of the NEMI User Group.
Table 45-4.
TFBGA Package Reference - Soldering Information (Substrate Level)
Ball Land
Diameter 450 µm
Soldering Mask Opening
350 µm
Table 45-5.
Device and 100-ball TFBGA Package Maximum Weight
SAM4S
141
mg
Table 45-6.
100-ball TFBGA Package Characteristics
Moisture Sensitivity Level
3
100-ball TFBGA Package Reference
JEDEC Drawing Reference
MO-275-DDAC-1
JESD97 Classification
e8