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Atmel SAM4L Xplained Pro Starter Kit Atmel ATSAM4L-XSTK ATSAM4L-XSTK Data Sheet

Product codes
ATSAM4L-XSTK
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Page of 1204
1174
42023E–SAM–07/2013
ATSAM4L8/L4/L2
43. Mechanical Characteristics
43.1
Thermal Considerations
43.1.1
Thermal Data
 summarizes the thermal resistance data depending on the package. 
43.1.2
Junction Temperature
The average chip-junction temperature, T
J
, in °C can be obtained from the following:
1.
2.
where:
•
θ
JA 
= package thermal resistance, Junction-to-ambient (°C/W), provided in 
.
•
θ
JC 
= package thermal resistance, Junction-to-case thermal resistance (°C/W), provided in 
•
θ
HEAT SINK 
= cooling device thermal resistance (°C/W), provided in the device datasheet.
• P
D 
= device power consumption (W) estimated from data provided in 
• T
A 
= ambient temperature (°C).
From the first equation, the user can derive the estimated lifetime of the chip and decide if a
cooling device is necessary or not. If a cooling device is to be fitted on the chip, the second
equation should be used to compute the resulting average chip-junction temperature T
J
 in °C.
Table 43-1.
Thermal Resistance Data
Symbol
Parameter
Condition
Package
Typ
Unit
θ
JA
Junction-to-ambient thermal resistance
Still Air
TQFP100
48.1
⋅C/W
θ
JC
Junction-to-case thermal resistance
TQFP100
13.3 
θ
JA
Junction-to-ambient thermal resistance
Still Air
VFBGA100
31.1
⋅C/W
θ
JC
Junction-to-case thermal resistance
VFBGA100
6.9
θ
JA
Junction-to-ambient thermal resistance
Still Air
WLCSP64
26.9
⋅C/W
θ
JC
Junction-to-case thermal resistance
WLCSP64
0.2
θ
JA
Junction-to-ambient thermal resistance
Still Air
TQFP64
49.6
⋅C/W
θ
JC
Junction-to-case thermal resistance
TQFP64
13.5
θ
JA
Junction-to-ambient thermal resistance
Still Air
QFN64
22.0
⋅C/W
θ
JC
Junction-to-case thermal resistance
QFN64
1.3
θ
JA
Junction-to-ambient thermal resistance
Still Air
TQFP48
51.1
⋅C/W
θ
JC
Junction-to-case thermal resistance
TQFP48
13.7
θ
JA
Junction-to-ambient thermal resistance
Still Air
QFN48
24.9
⋅C/W
θ
JC
Junction-to-case thermal resistance
QFN48
1.3
T
J
T
A
P
D
θ
JA
×
(
)
+
=
T
J
T
A
P
(
D
θ
(
HEATSINK
×
θ
JC
) )
+
+
=