Intel E3815 FH8065301567411 Data Sheet
Product codes
FH8065301567411
Thermal Management
Intel
®
Atom™ Processor E3800 Product Family
108
Datasheet
8
Thermal Management
The SoC’s thermal management system helps in managing the overall thermal profile
of the system to prevent overheating and system breakdown. The architecture
implements various proven methods of maintaining maximum performance while
remaining within the thermal spec. Throttling mechanisms are used to reduce power
consumption when thermal limits of the device are exceeded and the system is notified
of critical conditions via interrupts or thermal signalling pins. SoC thermal management
differs from legacy implementations primarily by replacing dedicated thermal
management hardware with firmware.
of the system to prevent overheating and system breakdown. The architecture
implements various proven methods of maintaining maximum performance while
remaining within the thermal spec. Throttling mechanisms are used to reduce power
consumption when thermal limits of the device are exceeded and the system is notified
of critical conditions via interrupts or thermal signalling pins. SoC thermal management
differs from legacy implementations primarily by replacing dedicated thermal
management hardware with firmware.
The thermal management features are:
•
Eight digital thermal sensors (DTS)
•
Supports a hardware trip point and four programmable trip points based on the
temperature indicated by thermal sensors.
temperature indicated by thermal sensors.
•
Supports different thermal throttling mechanisms.
8.1
CPU Thermal Management Registers
The description of the control and status registers can be found in the Bay Trail SoC
BIOS Writer’s Guide.
BIOS Writer’s Guide.
8.2
Thermal Sensors
SoC provides thermal sensors that use ring oscillator based DTS (Digital Thermal
Sensor) to provide more accurate measure of system thermals.
Sensor) to provide more accurate measure of system thermals.
The SoC instantiates multiple digital thermal sensors (one DTS for each processor core,
one for each BIU-Bus Interface Unit, and two for non-core SoC) and sensor grouping
configurations are provided to optionally select the maximum of all sensors for thermal
readout and interrupt generation.
one for each BIU-Bus Interface Unit, and two for non-core SoC) and sensor grouping
configurations are provided to optionally select the maximum of all sensors for thermal
readout and interrupt generation.
DTS output are adjusted for silicon variations. For a given temperature the output from
DTS is always the same irrespective of silicon.
DTS is always the same irrespective of silicon.
Table 62. Temperature Reading Based on DTS (If T
J-MAX
=90
ο
C) (Sheet 1 of 2)
DTS Counter Value
Temperature Reading
127
90
ο
C
137
80
ο
C
147
70
ο
C
157
60
ο
C
167
50
ο
C