Intel E3815 FH8065301567411 Data Sheet
Product codes
FH8065301567411
Ballout and Package Information
Intel
®
Atom™ Processor E3800 Product Family
Datasheet
207
10
Ballout and Package
Information
The SoC comes in a 25 mm X 27 mm Flip-Chip Ball Grid Array (FCBGA) package and
consists of a silicon die mounted face down on an organic substrate populated with
1170 solder balls on the bottom side. Capacitors may be placed in the area surrounding
the die. Because the die-side capacitors are electrically conductive, and only slightly
shorter than the die height, care should be taken to avoid contacting the capacitors
with electrically conductive materials. Doing so may short the capacitors and possibly
damage the device or render it inactive.
consists of a silicon die mounted face down on an organic substrate populated with
1170 solder balls on the bottom side. Capacitors may be placed in the area surrounding
the die. Because the die-side capacitors are electrically conductive, and only slightly
shorter than the die height, care should be taken to avoid contacting the capacitors
with electrically conductive materials. Doing so may short the capacitors and possibly
damage the device or render it inactive.
The use of an insulating material between the capacitors and any thermal solution
should be considered to prevent capacitor shorting. An exclusion, or keep out zone,
surrounds the die and capacitors, and identifies the contact area for the package. Care
should be taken to avoid contact with the package inside this area.
should be considered to prevent capacitor shorting. An exclusion, or keep out zone,
surrounds the die and capacitors, and identifies the contact area for the package. Care
should be taken to avoid contact with the package inside this area.
Refer to the Bay Trail SoC Thermal and Mechanical Design Guide for details on package
mechanical dimensions and tolerance, as well as other key package attributes.
mechanical dimensions and tolerance, as well as other key package attributes.
10.1
SoC Attributes
•
Package parameters: 25 mm X 27 mm
•
Ball Count:1170
All Units: mm
Tolerances if not specified:
•
.X: ± 0.1
•
.XX: ± 0.05
•
Angles: ± 1.0 degrees