Huawei ME99 Series Mini PCIe Module ME909 User Manual
HUAWEI ME909 Series Mini PCIe Module
Hardware Guide
Hardware Guide
Description of the Application Interfaces
Issue 0.1 (2013-06-09)
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
21
To meet the requirements of 3GPP TS 51.010-1 protocols and electromagnetic
compatibility (EMC) authentication, the USIM socket should be placed near the
PCIe interface (it is recommended that the PCB circuit connects the PCIe interface
and the USIM socket does not exceed 100 mm), because a long circuit may lead to
wave distortion, thus affecting signal quality.
compatibility (EMC) authentication, the USIM socket should be placed near the
PCIe interface (it is recommended that the PCB circuit connects the PCIe interface
and the USIM socket does not exceed 100 mm), because a long circuit may lead to
wave distortion, thus affecting signal quality.
It is recommended that you wrap the area adjacent to the UIM_CLK and
UIM_DATA signal wires with ground. The Ground pin of the USIM socket and the
Ground pin of the USIM card must be well connected to the power Ground pin
supplying power to the PCIe Adapter.
UIM_DATA signal wires with ground. The Ground pin of the USIM socket and the
Ground pin of the USIM card must be well connected to the power Ground pin
supplying power to the PCIe Adapter.
A 100 nF capacitor and1
μF capacitor are placed between the UIM_PWR and GND
pins in a parallel manner (If UIM_PWR circuit is too long, that the larger
capacitance such as 4.7
capacitance such as 4.7
μF can be employed if necessary). Three 33 pF
capacitors are placed between the UIM_DATA and Ground pins, the UIM_RESET
and Ground pins, and the UIM_CLK and Ground pins in parallel to filter
interference from RF signals.
and Ground pins, and the UIM_CLK and Ground pins in parallel to filter
interference from RF signals.
It is recommended to take electrostatic discharge (ESD) protection measures near
the USIM card socket. The TVS diode with Vrwm of 5 V and junction capacitance
less than 10 pF must be placed as close as possible to the USIM socket, and the
Ground pin of the ESD protection component is well connected to the power
Ground pin that supplies power to the PCIe Adapter.
the USIM card socket. The TVS diode with Vrwm of 5 V and junction capacitance
less than 10 pF must be placed as close as possible to the USIM socket, and the
Ground pin of the ESD protection component is well connected to the power
Ground pin that supplies power to the PCIe Adapter.
3.11 Audio Interface
Table 3-5 lists the
signals on the digital audio interface.
The software feature of PCM is planning.
Table 3-5 Signals on the digital audio interface
Pin
No.
No.
Pin Name
I/O
Description
DC Characteristics (V)
Min.
Typ.
Max.
45
PCM_CLK
O
PCM clock
–0.3
1.8
2.1
49
PCM_DIN
I
PCM data input
–0.3
1.8
2.1
51
PCM_SYNC
O
PCM interface sync
–0.3
1.8
2.1
47
PCM_DOUT
O
PCM data output
–0.3
1.8
2.1
The ME909 module interface enables communication with an external codec to
support linear format.
support linear format.