Kingston Technology 4GB, 1066MHz, DDR3, Non-ECC, Ultra LL, CL5 (5-5-5-15), SODIMM (Kit of 2), XMP KHX8500S3ULK2/4GX Data Sheet

Document No. 4805207-001.A00

06/02/09

Page 1

Kingston's KHX8500S3ULK2/4GX is a kit of two 256M x 64-bit 2GB (2048MB) PC3-8500 CL5 SDRAM (Synchronous
DRAM) memory modules. Each module is based on sixteen 128M x 8-bit DDR3 FBGA components. Total kit capacity
is 4GB (4096MB). Each module pair has been tested to run at DDR3- 1066MHz at an ultra-low latency timing of
5-5-5-15 at 1.5V. The SPDs are programmed to JEDEC standard latency 1066Mhz timing of 7-7-7 at 1.5V. Each
204-pin SODIMM uses gold contact fingers and requires +1.5V. The electrical and mechanical specifications are as

follows:

JEDEC standard 1.5V ± 0.075V Power Supply

VDDQ = 1.5V ± 0.075V

533MHz fCK for 1066Mb/sec/pin

8 independent internal bank

Programmable CAS Latency: 5,6,7,8

Posted CAS

Programmable Additive Latency: 0, CL - 2, or CL - 1 clock

Programmable CAS Write Latency(CWL) = 6(DDR3-1066)

8-bit pre-fetch

Burst Length: 8 (Interleave without any limit, sequential with starting address “000” only), 4 with tCCD = 4

which does not allow seamless read or write [either on the fly using A12 or MRS]

Bi-directional Differential Data Strobe

Internal(self) calibration : Internal self calibration through ZQ pin (RZQ : 240 ohm ± 1%)

On Die Termination using ODT pin

Average Refresh Period 7.8us at lower then TCASE 85°C, 3.9us at 85°C < TCASE . 95°C

Asynchronous Reset

PCB : Height 1.180” (30.00mm), double  sided  component

CL(IDD)

7 cycles

Row Cycle Time (tRCmin)

50.63ns (min.)

Refresh to Active/Refresh Command Time (tRFCmin)

110ns

Row Active Time (tRASmin)

37.5ns (min.)

Power

1.320 W (operating per module)

UL Rating

94 V - 0

Operating Temperature

0

o

 C to 85

o

 C

Storage Temperature

-55

o

 C to +100

o

 C