Intel DP55WB, 10-Pack BLKDP55WB?KIT User Manual
Product codes
BLKDP55WB?KIT
Japan
VCCI V-3/04.04, V-4/03.04, Class B
South Korea
South Korea
KN-22:2005 and KN-24:2005
taiwan
taiwan
CNS 13438:2006 Class B
International
International
CISPR 22:2005 +A1:2005 +A2:2006 Class B
environmental compliance
europe
environmental compliance
europe
Europe RoHS (Directive 2002/95/EC)
china
china
China RoHS (MII Order # 39)
Lead-Free: The symbol is used to identify
electrical and electronic assemblies and com-
ponents in which the lead (Pb) concentration
level in any of the raw materials and the end product
is not greater than 0.1% by weight (1000 ppm). This
symbol is also used to indicate conformance to lead-
free requirements and definitions adopted under
the European Union’s Restriction on Hazardous
Substances (RoHS) directive, 2002/95/EC.
For ordering information, visit
www.intel.com
For the most current product information,
visit www.intel.com/go/idb
or http://ark.intel.com
visit www.intel.com/go/idb
or http://ark.intel.com
For specific CPU compatibility, visit
http://processormatch.intel.com
proceSSor
processor Support
• Intel® Core™ i7 and Intel® Core™ i5 processors in the
LGA1156 package
• Intel® Turbo Boost Technology
1
• Intel® Hyper-Threading Technology
2
• Supports Intel® 64 architecture
5
cHIpSet
New Intel® p55 express chipset
• Intel® 82P55 Platform Controller Hub (PCH)
• Intel® Matrix Storage Technology (RAID 0, 1, 5, 10)
• Six onboard SATA ports
uSB 2.0
Integrated Intel® pcH controllers
• Eight Hi-Speed USB 2.0 ports via back panel
• Six additional ports via internal headers
System BIoS
System BIoS
• 16 Mb Flash EEPROM with Intel® Platform Innovation
Framework for EFI Plug and Play, IDE drive auto-
configure
• Advanced configuration and power interface
V3.0b, DMI 2.5
• Intel® Express BIOS update support: BIOS update
via new F7 function key
Hardware Management Features
Hardware Management Features
• Processor fan speed control
• System chassis fan speed control
• Voltage and temperature sensing
• Fan sensor inputs used to monitor fan activity
• Power management support for ACPI 3.0b
1
Intel® Turbo Boost Technology requires a PC with a processor with Intel Turbo Boost Technology capability. Intel Turbo Boost Technology performance varies depending on hardware, software, and overall
system configuration. Check with your PC manufacturer on whether your system delivers Intel Turbo Boost Technology. See www.intel.com/technology/turboboost for more information.
2
Intel® Hyper-Threading Technology requires a computer system with a processor supporting HT Technology and an HT Technology-enabled chipset, BIOS, and operating system. Performance will vary
depending on the specific hardware and software you use. For more information including details on which processors support HT Technology, see www.intel.com/info/hyperthreading.
3
System resources and hardware (such as PCI and PCI Express*) require physical memory address locations that can reduce available addressable system memory. This could result in a reduction of as much
as 1 GB or more of physical addressable memory being available to the operating system and applications, depending on the system configuration and operating system.
4
Intel® High Definition Audio requires a system with an appropriate Intel® chipset and a motherboard with an appropriate codec and the necessary drivers installed. System sound quality will vary depending
on actual implementation, controller, codec, drivers, and speakers. For more information about Intel® HD Audio, refer to www.intel.com/design/chipsets/hdaudio.htm
5
64-bit computing on Intel® architecture requires a computer system with a processor, chipset, BIOS, operating system, device drivers, and applications enabled for Intel® 64 architecture. Processors will not
operate (including 32-bit operation) without an Intel 64 architecture-enabled BIOS. Performance will vary depending on your hardware and software configurations. See http://developer.intel.com/technology/
intel64/index.htm for more information.
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS
GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS
OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR
INFRINGEMENT OF ANY PATENT, COPYRIGHT, OR OTHER INTELLECTUAL PROPERTY RIGHT.
Intel products are not intended for use in medical, life-saving, or life-sustaining applications. Intel may make changes to specifications and product descriptions at any time, without notice.
All products, dates, and figures specified are preliminary based on current expectations, and are subject to change without notice. Availability in different channels may vary.
Actual Intel® Desktop Board may differ from the image shown.
Intel, the Intel logo, Intel Core, and Core Inside are trademarks of Intel Corporation in the U.S. and other countries.
* Other names and brands may be claimed as the property of others.
Copyright © 2009 Intel Corporation. All rights reserved. 0709/AC/MS/PDF 322333-001US
All products, dates, and figures specified are preliminary based on current expectations, and are subject to change without notice. Availability in different channels may vary.
Actual Intel® Desktop Board may differ from the image shown.
Intel, the Intel logo, Intel Core, and Core Inside are trademarks of Intel Corporation in the U.S. and other countries.
* Other names and brands may be claimed as the property of others.
Copyright © 2009 Intel Corporation. All rights reserved. 0709/AC/MS/PDF 322333-001US
Intel® Desktop Board DP55WB Media Series
Technical Specifications
Intel® pro 10/100/1000 Network connection
• New low-power design can meet Energy Star* 5.0
specifications
expansion capabilities
expansion capabilities
• One PCI Express* 2.0 x16 slot
• Two PCI Express 2.0 x1 slots
• One PCI slot
Audio
Audio
• 5.1-channel Intel® High Definition Audio
4
codec
SySteM MeMory
Memory capacity
• Four 240-pin DIMM connectors
Memory types
Memory types
• DDR3 1333 / 1066 SDRAM memory support
• Non-ECC Memory
Memory Modes
Memory Modes
• Dual- or single-channel operation support
Memory Voltage
Memory Voltage
• 1.5 V standard JEDEC voltage
JumPErS AnD FronT-PAnEL ConnECTorS
Jumpers
• Single configuration jumper design
• Jumper access for BIOS maintenance mode
Front-panel connectors
Front-panel connectors
• Reset, HD LED, Power LEDs, power on/off
• Three front-panel Hi-Speed USB 2.0 headers
• Front-panel audio header
mECHAnICAL
Board Style
• MicroATX
Board Size
Board Size
• 9.6” x 9.6” (24.38 cm x 24.38 cm)
Baseboard power requirements
Baseboard power requirements
• ATX 12 V
eNVIroNMeNt
operating temperature
• 0° C to +55° C
Storage temperature
Storage temperature
• -20° C to +70° C
rEGuLATIonS AnD SAFETy STAnDArDS
united States and canada
CSA/UL 60950-1, First Edition (Binational Standard)
europe
europe
(Low Voltage Directive 2006/95/EC)
EN 60950-1:2006
International
International
IEC 60950-1:2001, First Edition
eMc regulations (tested in representative chassis)
eMc regulations (tested in representative chassis)
united States
FCC 47 CFR Part 15, Subpart B
canada
canada
ICES-003 Class B
europe
europe
(EMC Directive 2004/108/EC)
EN 55022:2006 and EN 55024:1998
Australia/New Zealand
Australia/New Zealand
EN 55022:2006 Class B