Supermicro Intel Xeon E3-1220 v2 User Manuals

Table of Contents

• 1 Overview

  13
  • 1.1 Introduction

    13
    • 1.1.1 Processor Feature Details

      14
    • 1.1.2 Supported Technologies

      15
  • 1.2 Interfaces

    15
    • 1.2.1 System Memory Support

      15
    • 1.2.2 PCI Express*

      16
    • 1.2.3 Direct Media Interface Gen 2 (DMI2)

      18
    • 1.2.4 Intel® QuickPath Interconnect (Intel® QPI)

      18
    • 1.2.5 Platform Environment Control Interface (PECI)

      19
  • 1.3 Power Management Support

    19
    • 1.3.1 Processor Package and Core States

      19
    • 1.3.2 System States Support

      19
    • 1.3.3 Memory Controller

      19
    • 1.3.4 PCI Express

      20
    • 1.3.5 Intel QuickPath Interconnect

      20
  • 1.4 Thermal Management Support

    20
  • 1.5 Package Summary

    20
  • 1.6 Terminology

    20
  • 1.7 Related Documents

    23
  • 1.8 State of Data

    24
• 2 Interfaces

  25
  • 2.1 System Memory Interface

    25
    • 2.1.1 System Memory Technology Support

      25
    • 2.1.2 System Memory Timing Support

      25
  • 2.2 PCI Express* Interface

    26
    • 2.2.1 PCI Express* Architecture

      26
    • 2.2.2 PCI Express* Configuration Mechanism

      27
  • 2.3 DMI2/PCI Express* Interface

    28
    • 2.3.1 DMI2 Error Flow

      28
    • 2.3.2 Processor/PCH Compatibility Assumptions

      28
    • 2.3.3 DMI2 Link Down

      28
  • 2.4 Intel QuickPath Interconnect

    28
  • 2.5 Platform Environment Control Interface (PECI)

    30
    • 2.5.1 PECI Client Capabilities

      30
    • 2.5.2 Client Command Suite

      31
    • 2.5.3 Client Management

      69
    • 2.5.4 Multi-Domain Commands

      74
    • 2.5.5 Client Responses

      75
    • 2.5.6 Originator Responses

      76
    • 2.5.7 DTS Temperature Data

      76
• 3 Technologies

  79
  • 3.1 Intel® Virtualization Technology (Intel® VT)

    79
    • 3.1.1 Intel VT-x Objectives

      79
    • 3.1.2 Intel VT-x Features

      80
    • 3.1.3 Intel VT-d Objectives

      80
    • 3.1.4 Intel Virtualization Technology Processor Extensions

      81
  • 3.2 Security Technologies

    81
    • 3.2.1 Intel® Trusted Execution Technology

      81
    • 3.2.2 Intel Trusted Execution Technology – Server Extensions

      82
    • 3.2.3 Intel® Advanced Encryption Standard Instructions (Intel® AES-NI)

      82
    • 3.2.4 Execute Disable Bit

      83
  • 3.3 Intel® Hyper-Threading Technology

    83
  • 3.4 Intel® Turbo Boost Technology

    83
    • 3.4.1 Intel® Turbo Boost Operating Frequency

      83
  • 3.5 Enhanced Intel SpeedStep® Technology

    84
  • 3.6 Intel® Intelligent Power Technology

    84
  • 3.7 Intel® Advanced Vector Extensions (Intel® AVX)

    84
  • 3.8 Intel® Dynamic Power Technology (Intel® DPT)

    85
• 4 Power Management

  87
  • 4.1 ACPI States Supported

    87
    • 4.1.1 System States

      87
    • 4.1.2 Processor Package and Core States

      87
    • 4.1.3 Integrated Memory Controller States

      88
    • 4.1.4 DMI2/PCI Express Link States

      89
    • 4.1.5 Intel QuickPath Interconnect States

      89
    • 4.1.6 G, S, and C State Combinations

      89
  • 4.2 Processor Core/Package Power Management

    90
    • 4.2.1 Enhanced Intel SpeedStep® Technology

      90
    • 4.2.2 Low-Power Idle States

      90
    • 4.2.3 Requesting Low-Power Idle States

      91
    • 4.2.4 Core C-states

      92
    • 4.2.5 Package C-States

      94
    • 4.2.6 Package C-State Power Specifications

      97
  • 4.3 System Memory Power Management

    97
    • 4.3.1 CKE Power-Down

      98
    • 4.3.2 Self Refresh

      98
    • 4.3.3 DRAM I/O Power Management

      99
  • 4.4 DMI2/PCI Express* Power Management

    99
• 5 Thermal Management Specifications

  101
  • 5.1 Package Thermal Specifications

    101
    • 5.1.1 Thermal Specifications

      101
    • 5.1.2 TCASE and DTS Based Thermal Specifications

      102
    • 5.1.3 Processor Thermal Profiles

      104
    • 5.1.4 Embedded Server Processor Thermal Profiles

      132
    • 5.1.5 Thermal Metrology

      137
  • 5.2 Processor Core Thermal Features

    138
    • 5.2.1 Processor Temperature

      138
    • 5.2.2 Adaptive Thermal Monitor

      138
    • 5.2.3 On-Demand Mode

      140
    • 5.2.4 PROCHOT_N Signal

      140
    • 5.2.5 THERMTRIP_N Signal

      141
    • 5.2.6 Integrated Memory Controller (IMC) Thermal Features

      141
• 6 Signal Descriptions

  143
  • 6.1 System Memory Interface Signals

    143
  • 6.2 PCI Express* Based Interface Signals

    144
  • 6.3 DMI2/PCI Express* Port 0 Signals

    146
  • 6.4 Intel QuickPath Interconnect Signals

    146
  • 6.5 PECI Signal

    147
  • 6.6 System Reference Clock Signals

    147
  • 6.7 JTAG and TAP Signals

    147
  • 6.8 Serial VID Interface (SVID) Signals

    148
  • 6.9 Processor Asynchronous Sideband and Miscellaneous Signals

    148
  • 6.10 Processor Power and Ground Supplies

    150
• 7 Electrical Specifications

  153
  • 7.1 Processor Signaling

    153
    • 7.1.1 System Memory Interface Signal Groups

      153
    • 7.1.2 PCI Express* Signals

      153
    • 7.1.3 DMI2/PCI Express* Signals

      153
    • 7.1.4 Intel QuickPath Interconnect (Intel QPI)

      153
    • 7.1.5 Platform Environmental Control Interface (PECI)

      154
    • 7.1.6 System Reference Clocks (BCLK{0/1}_DP, BCLK{0/ 1}_DN)

      154
    • 7.1.7 JTAG and Test Access Port (TAP) Signals

      155
    • 7.1.8 Processor Sideband Signals

      155
    • 7.1.9 Power, Ground and Sense Signals

      155
    • 7.1.10 Reserved or Unused Signals

      160
  • 7.2 Signal Group Summary

    160
  • 7.3 Power-On Configuration (POC) Options

    164
  • 7.4 Fault Resilient Booting (FRB)

    165
  • 7.5 Mixing Processors

    165
  • 7.6 Flexible Motherboard Guidelines (FMB)

    166
  • 7.7 Absolute Maximum and Minimum Ratings

    166
    • 7.7.1 Storage Conditions Specifications

      167
  • 7.8 DC Specifications

    168
    • 7.8.1 Voltage and Current Specifications

      169
    • 7.8.2 Die Voltage Validation

      175
    • 7.8.3 Signal DC Specifications

      176
  • 7.9 Signal Quality

    183
    • 7.9.1 DDR3 Signal Quality Specifications

      183
    • 7.9.2 I/O Signal Quality Specifications

      183
    • 7.9.3 Intel QuickPath Interconnect Signal Quality Specifications

      184
    • 7.9.4 Input Reference Clock Signal Quality Specifications

      184
    • 7.9.5 Overshoot/Undershoot Tolerance

      184
• 8 Processor Land Listing

  187
  • 8.1 Listing by Land Name

    187
  • 8.2 Listing by Land Number

    212
• 9 Package Mechanical Specifications

  237
  • 9.1 Package Mechanical Drawing

    237
  • 9.2 Processor Component Keep-Out Zones

    241
  • 9.3 Package Loading Specifications

    241
  • 9.4 Package Handling Guidelines

    241
  • 9.5 Package Insertion Specifications

    241
  • 9.6 Processor Mass Specification

    242
  • 9.7 Processor Materials

    242
  • 9.8 Processor Markings

    242
• 10 Boxed Processor Specifications

  243
  • 10.1 Introduction

    243
    • 10.1.1 Available Boxed Thermal Solution Configurations

      243
    • 10.1.2 Intel Thermal Solution STS200C (Passive/Active Combination Heat Sink Solution)

      243
    • 10.1.3 Intel Thermal Solution STS200P and STS200PNRW (Boxed 25.5 mm Tall Passive Heat Sink Solutions)

      244
  • 10.2 Mechanical Specifications

    245
    • 10.2.1 Boxed Processor Heat Sink Dimensions and Baseboard Keepout Zones

      245
    • 10.2.2 Boxed Processor Retention Mechanism and Heat Sink Support (ILM-RS)

      254
  • 10.3 Fan Power Supply [STS200C]

    254
    • 10.3.1 Boxed Processor Cooling Requirements

      255
  • 10.4 Boxed Processor Contents

    256