3M electronic equipment assembly Manual De Usuario

3M Bonding 
Systems Division

Market: Electronic
Account Type:  Electronic Equipment Assembly 

3M

™

Z-Axis Adhesive 

Film 5303R 

North America

Bonding Flexible Printed Circuit 

3679 – Electronic Components
3672 – Printed Circuit Board

3M

™

Z-Axis Adhesive Film 5303R represents an alternative to many lead-based

interconnections systems such as solder.  Electrically connects and mechanically
bonds flexible printed circuit—including TAB (Tape Automated Bonding)
circuits—to a variety of electronic substrates and metallizations, including
printed circuit boards, glass substrates (LCD displays) and flex circuits.

Heat and pressure bond using hot bar bonder. 

Fine pitch interconnect.

Fine pitch interconnection: Bonds to pads as small as 100 mil²; pitch as fine
as 5.5 mils.

High reliability, stable properties: Eliminates solder bridging.  Thermoset
adhesive provides stability of mechanical and electrical properties under many
demanding environmental conditions such as burn-in and thermal cycling tests.

Lead-free, no fluxes, no cleaning: An alternative to lead-based solder
connection; helps reduce cleaning chemicals; helps save processing steps.

Dry film construction: Adhesive supplied on poly release liner for easy
handling; dry assembly using hot-bar reflow bonder.  Ideal for boards with
mixed through-hole surface mount technologies.

Repairable bond: High component utilization which helps reduce scrap, rework
and  helps provide cost and time savings.