Nokia 5510 Manuales De Servicio

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CONFIDENTIAL 
 
2(11) 
 
Product NPM-5  
Repairhints 
Customer Care Europa & Africa 
Introduction 
Version 1.0 Approved
 
 2002 SCCE Training Group 
Date 08.04.2002 
 
 
npm_5_repair_v1_0.doc 
 
Checked by: 
SCCE Training Group 
Approved by: 
SCCE 
General 
 
 
 
 
 
 
 
 
 
 
- How to use this document 
 
Place the schematics behind this manual. 
Now you are able to follow these specifictions with graphical layouts and it is easier for you to find the components and 
measuring points. 
 
-General handling 
 
There are different screw lengths so pay attention to the right screw position. All screws must be tightened with a 
torque of 
17Ncm. If a higher torque is used, the B_cover and spacer frame might be damaged. 
When connecting the phone to the flash box (Fla-7 or FPS-8), generally 
contact service will be shown on display because the UI 
module is hold in reset state to protect it for software corruption. 
 
-µBGA components and broken balls 
 
Special attention to µBGA components: 
All µBGA´s with exception of MAD D300 are replaceable and must be renewed after removing. Reflow by hot air fan is not 
allowed. 
Check soldering points, remove oxidated solderings (broken balls) carefully by enclosing a few new solders before placing new 
components. The only allowed way to change µBGA components is the use of µBGA rework maschines, approved from NMP (e.g. 
ZEVAC/ OK International). Use recommended Fluxtype and an appropriate amount only 
 
-Component characteristics 
 
Some components contain important data. 
Several described steps are only practicable if you are able to reflash/ realign the card phone and/ or rewrite IMEI/ 
SIMlock in certain cases. Please pay attention to separate notes. 
 
-Realign after repair 
 
Characteristics of replacement parts are different. 
To prevent additional faults after repair (RX quality, TX power etc.) it is necessary to retune phone values.