Nokia 8390 Manuales De Servicio
PAMS Technical Documentation
Troubleshooting Instructions
NSB-8
Issue 1 01/02
ãNokia Corporation
Page 35
General instructions
Most semiconductors are static discharge sensitive! ESD protection must be taken care
of during repair (ground straps and ESD soldering irons). HAGAR, PA, UEM, UPP, and Flash
are moisture sensitive and must be pre-baked prior to soldering, if they have been out of
their vacuum package longer than the specified time.
of during repair (ground straps and ESD soldering irons). HAGAR, PA, UEM, UPP, and Flash
are moisture sensitive and must be pre-baked prior to soldering, if they have been out of
their vacuum package longer than the specified time.
• Connect test jig to computer with DAU-9S cable or to FPS-8 Flash Prommer with
AXS-4 serial cable.
• Make sure that you have PKD-1 dongle connected to computer’s parallel port.
• Connect DC power supply to module test jig with FLC-2 cable.
• Set the DC supply voltage to 3.9 V and set the module test jig (MJS-46) jumper
connector to ”bypass” position. VBAT must not exceed 5.15 V to avoid damaging
the power amplifier (PA), if PA is active.
the power amplifier (PA), if PA is active.
• MJS-46’s current consumption is ~ 9 mA. Note that MJS-46 is not pro-
tected against reverse voltage and there is a 2 A fuse which may blow if the
phone is shortcircuited.
phone is shortcircuited.
• When doing BB energy management (EM) calibrations use JBV-1 jig and DC sup-
ply voltage 12 – 15 V.
• JBV-1’s current consumption is ~ 40 mA with 3.9 V supply voltage and ~ 80
mA with 15 V supply voltage.
• Set the phone module to test jig and start Phoenix service software. Initialize
connection to phone (use FBUS driver when using DAU-9S and COMBOX driver
when using FPS-8).
when using FPS-8).