Intel Core™2 Duo Processor E8500 (6M Cache, 3.16 GHz, 1333 MHz FSB) BX80570E8500A Manual De Usuario

Intel

Los códigos de productos

BX80570E8500A

Thermal and Mechanical Design Guidelines

3

Contents

Introduction ...................................................................................................11

Document Goals and Scope ...................................................................11

Importance of Thermal Management ..........................................11

Document Goals......................................................................11

Document Scope .....................................................................12

References ..........................................................................................13

Definition of Terms ...............................................................................13

Processor Thermal/Mechanical Information .........................................................15

Mechanical Requirements ......................................................................15

Processor Package...................................................................15

Heatsink Attach ......................................................................17

General Guidelines....................................................17

Heatsink Clip Load Requirement..................................17

Additional Guidelines.................................................18

Thermal Requirements ..........................................................................18

Processor Case Temperature .....................................................18

Thermal Profile .......................................................................19

Thermal Solution Design Requirements ......................................19

..................................................................................20

Heatsink Design Considerations..............................................................21

Heatsink Size..........................................................................22

Heatsink Mass.........................................................................22

Package IHS Flatness...............................................................23

Thermal Interface Material........................................................23

System Thermal Solution Considerations .................................................24

Chassis Thermal Design Capabilities...........................................24

Improving Chassis Thermal Performance ....................................24

Summary...............................................................................25

System Integration Considerations..........................................................25

Thermal Metrology ..........................................................................................27

Characterizing Cooling Performance Requirements ....................................27

Example ................................................................................28

Processor Thermal Solution Performance Assessment ................................29

Local Ambient Temperature Measurement Guidelines.................................29

Processor Case Temperature Measurement Guidelines ...............................32

Thermal Management Logic and Thermal Monitor Feature .....................................33

Processor Power Dissipation...................................................................33

Thermal Monitor Implementation ............................................................33

PROCHOT# Signal ...................................................................34

Thermal Control Circuit ............................................................34

Thermal Monitor .......................................................34

Thermal Monitor 2 ...................................................................35

Operation and Configuration .....................................................36