Corsair 2GB(2 x 1GB), DDR3, 1600MHz, KIT, CL7, PC3-12800 TWIN3X2048-1600C7DHX Prospecto
Los códigos de productos
TWIN3X2048-1600C7DHX
www.corsair.com
The Twin3X2048-1600C7DHX G is a 2048MByte matched pair of DDR3 SDRAM DIMMs built
using Corsair’s latest high performance heat sink with Dual-Path Heat Xchange (DHX)
technology. This part delivers outstanding performance in the latest generation of
dual-channel DDR3-based motherboards. It has been tested extensively in popular DDR3
motherboards to ensure compatibility and performance at its rated speed. This memory has
been verified to operate at 1600MHz at the low latencies of 7-7-7-20.
using Corsair’s latest high performance heat sink with Dual-Path Heat Xchange (DHX)
technology. This part delivers outstanding performance in the latest generation of
dual-channel DDR3-based motherboards. It has been tested extensively in popular DDR3
motherboards to ensure compatibility and performance at its rated speed. This memory has
been verified to operate at 1600MHz at the low latencies of 7-7-7-20.
TWIN3X2048-1600C7DHX G
Every part is tested in Corsair's factory at 1600MHz, but your actual results may vary depending on the overclocking margin of your CPU and motherboard. Newer motherboards may be
used for production test as they become available. Corsair may periodically update the part with newer RAM revisions of same or greater performance. RAM used on the module may
change without notice. © July 2007 Corsair Memory, Inc.
used for production test as they become available. Corsair may periodically update the part with newer RAM revisions of same or greater performance. RAM used on the module may
change without notice. © July 2007 Corsair Memory, Inc.
FEATURES
2048 Megabytes of DDR3 memory
Two matched CM3X1024-1600C7DHX G
modules
Using DHX technology providing
maximum cooling
100% tested at 1600MHz in high performance
DDR3 motherboards
Lifetime warranty
TEST SPECS
Each module pair is tested together at
1600MHz
Tested and packaged in pairs
Packaged together immediately following
system test
Tested together at 1600MHz, Vdimm =
1.80V, at latency settings of 7-7-7-20
SPD programmed at:
JEDEC standard 9-9-9-24 values at
1333MHz
Dual-Path Heat Xchange Diagram
• Optimized fins to maximize ambient airflow through the module array
• Extruded aluminum heat sinks to maximize convective heat dissipation
• Dedicated PCB heat sink