STMicroelectronics Discovery kit for STM32L151/152 line - with STM32L152RC MCU STM32L152C-DISCO STM32L152C-DISCO Hoja De Datos
Los códigos de productos
STM32L152C-DISCO
DocID022799 Rev 6
125/132
STM32L15xCC STM32L15xRC STM32L15xUC STM32L15xVC
Package characteristics
131
7.2 Thermal
characteristics
The maximum chip-junction temperature, T
J
max, in degrees Celsius, may be calculated
using the following equation:
T
J
max = T
A
max + (P
D
max ×
JA
)
Where:
T
A
max is the maximum ambient temperature in
C,
JA
is the package junction-to-ambient thermal resistance, in
C/W,
P
D
max is the sum of P
INT
max and P
I/O
max (P
D
max = P
INT
max + P
I/O
max),
P
INT
max is the product of I
DD
and
V
DD
, expressed in Watts. This is the maximum chip
internal power.
P
I/O
max represents the maximum power dissipation on output pins where:
P
I/O
max
=
(V
OL
× I
OL
) +
((V
DD
– V
OH
) × I
OH
),
taking into account the actual V
OL
/ I
OL
and V
OH
/ I
OH
of the I/Os at low and high level in the
application.
Table 72. Thermal characteristics
Symbol
Parameter
Value
Unit
JA
Thermal resistance junction-ambient
UFBGA100 - 7 x 7 mm
59
°C/W
Thermal resistance junction-ambient
LQFP100 - 14 x 14 mm / 0.5 mm pitch
43
Thermal resistance junction-ambient
LQFP64 - 10 x 10 mm / 0.5 mm pitch
46
Thermal resistance junction-ambient
WLCSP63 - 0.400 mm pitch
49
Thermal resistance junction-ambient
LQFP48 - 7 x 7 mm / 0.5 mm pitch
55
Thermal resistance junction-ambient
UFQFPN48 - 7 x 7 mm / 0.5 mm pitch
16