Kingston Technology KHX5300S2LLK2/2G Hoja De Datos
DESCRIPTION
Kingston's KHX5300S2LLK2/2G is a kit of two 128M x 64-bit
(1GB) CL4 low latency SDRAM (Synchronous DRAM) 1Rx8
memory modules. Each module is based on eight 128M x 8-bit
DDR2 FBGA components. Total kit capacity is 2GB. The SPDs
are programmed to JEDEC low latency timing of 4-4-4-12 at
1.8V. Each 200-pin SODIMM uses gold contact fingers and
requires +1.8V. The electrical and mechanical specifications
are as follows:
Document No. 4804934-001.B00 06/30/11 Page 1
*Power will vary depending on the SDRAM used.
Memory Module Specifi cations
KHX5300S2LLK2/2G
2GB (1GB 128M x 64-Bit x 2 pcs.)
PC2-5300 CL4 200-Pin SODIMM Kit
PC2-5300 CL4 200-Pin SODIMM Kit
Continued >>
SPECIFICATIONS
Clock Cycle Time (tCK)
3ns (min.) / 8ns (max.)
Row Cycle Time (tRCmin)
60ns (min.)
Refresh to Active/Refresh
127.5ns (min.)
Command Time (tRFCmin)
Row Active Time (tRASmin)
36ns (min.) / 70,000 (max.)
Single Power Supply of
+1.8V (+/- .1V)
Power (Operating)
TBD* (per module)
UL Rating
94 V - 0
Operating Temperature
0
o
C to 55
o
C
Storage Temperature
-55
o
C to +125
o
C
FEATURES
•
Power supply : Vdd: 1.8V ± 0.1V, Vddq: 1.8V ± 0.1V
•
Double-data-rate architecture; two data transfers per
clock cycle
•
Bidirectional data strobe(DQS)
•
Differential clock inputs(CK and CK)
•
DLL aligns DQ and DQS transition with CK transition
•
Programmable Read latency 5, 4, 3 (clock)
•
Burst Length: 4, 8 (Interleave/nibble sequential)
•
Programmable Burst type (sequential & interleave)
•
Timing Reference: 4-4-4-12 at +1.8V
•
Edge aligned data output, center aligned data input
•
Auto & Self refresh, 7.8us refresh interval (8K/64ms
refresh)
•
Serial presence detect with EEPROM
•
PCB : Height 1.180” (30.00mm), double sided
component