Compaq 164SX Manual De Usuario
Memory and Microprocessor Configuration
5–5
Increasing Microprocessor Speed
Figure 5–1 Fan/Heat-Sink Assembly
a.
Put the GRAFOIL thermal pad in place. The GRAFOIL pad is used to
improve the thermal conductivity between the chip package and the heat
sink by replacing micro air pockets with a less insulative material. Perform
the following steps to position the GRAFOIL pad:
improve the thermal conductivity between the chip package and the heat
sink by replacing micro air pockets with a less insulative material. Perform
the following steps to position the GRAFOIL pad:
1. Perform a visual inspection of the package slug to ensure that it is free of
contamination.
2. Wearing clean gloves, pick up the GRAFOIL pad. Do not perform this
with bare hands because skin oils can be transferred to the pad.
3. Place the GRAFOIL pad on the gold-plated slug surface and align it with
the threaded studs.
Screw, 6–32 × 0.625 in
Qty 4
Torque to 3
Qty 4
Torque to 3
±
1 in-lb
Fan
Clip, Heat-Sink/Chip/Fan
Nut, Hex,
Aluminum
Flats, Qty 2
Torque to15
Aluminum
Flats, Qty 2
Torque to15
±
2 in-lb
Heat Sink, with Fan
Mounting Holes
Mounting Holes
Thermal Pad
Alpha 21164PC
Airflow