Alps Electric SKPL Series Manuel D’Utilisation
Snap-in
Type
Type
Surface
Mount Type
Mount Type
Radial
Type
Type
TACT Switch
TM
Sharp
Feeling
Feeling
Soft
Feeling
Feeling
374
Detector
Push
Slide
Rotary
Encoders
Power
Dual-in-line
Package Type
Package Type
Multi Control
Devices
Devices
Custom-
Products
Products
TACT Switch
TM
1. Heating method: Double heating method with infrared heater.
2. Temperature measurement: Thermocouple 0.1 to 0.2
φ CA（K）or CC（T）at solder joints（copper foil surface）. A heat resistive tape
should be used to fix thermocouple.
3. Temperature profile
Soldering Conditions
Condition for Reflow
Available for Surface Mount Type.
180
150
260˚C max. 3 sec max.
230˚C
Time
120 sec max.（ pre-heating ）
3 to 4min.
Time inside soldering equipment
Temperature (˚C )
40s max.
Manual Soldering
（Except SKRT series）
Flux built-up
Mounting surface
should not be exposed to flax
Ambient temperature of the soldered
surface of PC board.
100
℃ max.
60s max.
260
℃ max.
5s max.
Preheating temperature
Preheating time
Soldering temperature
Duration of immersion
Items
Condition
Condition
2times max.
Number of soldering
Soldering temperature
350
℃max.
3s max.
Duration of soldering
60W max.
Capacity of soldering iron
Items
1. Consult with us for TACT Switch
TM
washing conditions.
2. Prevent flux penetration from the top side of the TACT Switch
TM
.
3. Switch terminals and a PC board should not be coated with flux prior to soldering.
4. The second soldering should be done after the switch returns to normal temperature.
5. Use the flux with a specific gravity of min 0.81.
4. The second soldering should be done after the switch returns to normal temperature.
5. Use the flux with a specific gravity of min 0.81.
（EC-19S-8 by TAMURA Corporation, or equivalents.）
Notes
Conditions for Auto-dip
Available for Snap-in Type and Radial Type
（Except SKHJ, SKHL, SKQJ, SKQK, SKEG series）
1. The above temperature shall be measured on the mounting surface of a PC board. There are cases where the PC
board's temperature greatly differs from that of the switch, depending on the material, size, thickness of PC boards
and others. The above-stated conditions shall also apply to switch surface temperatures.
and others. The above-stated conditions shall also apply to switch surface temperatures.
2. Soldering conditions differ depending on reflow soldering machines. Prior verification of soldering condition is
highly recommended.
Note