Intel Xeon 7130N LF80550KF0878M Fiche De Données
Codes de produits
LF80550KF0878M
Dual-Core Intel
®
Xeon
®
Processor 7000 Series Datasheet
97
8
Boxed Processor Specifications
8.1
Introduction
The Dual-Core Intel Xeon processor 7000 series will be offered as an Intel boxed processor. Intel
boxed processors are intended for system integrators who build systems from components
available through distribution channels. The boxed thermal solution is under development and is
subject to change. This section is meant to provide some insight into the current direction of the
thermal solution. Future revisions may have solutions that differ from those discussed here.
boxed processors are intended for system integrators who build systems from components
available through distribution channels. The boxed thermal solution is under development and is
subject to change. This section is meant to provide some insight into the current direction of the
thermal solution. Future revisions may have solutions that differ from those discussed here.
The current thermal solution plan for the boxed Dual-Core Intel Xeon processor 7000 series is to
include an unattached passive heatsink. This solution is currently targeted at chassis which are 3U
and above in height.
include an unattached passive heatsink. This solution is currently targeted at chassis which are 3U
and above in height.
This section documents baseboard and platform requirements for the thermal solution, supplied
with the boxed Dual-Core Intel Xeon processor 7000 series. This section is particularly important
to companies that design and manufacture baseboards, chassis and complete systems.
with the boxed Dual-Core Intel Xeon processor 7000 series. This section is particularly important
to companies that design and manufacture baseboards, chassis and complete systems.
shows the conceptual drawing of the boxed processor thermal solution.
Drawings in this section reflect only the specifications on the Intel boxed processor product. These
dimensions should not be used as a generic keepout zone for all cooling solutions. It is the system
designer’s responsibility to consider their proprietary cooling solution when designing to the
required keepout zone on their system platform and chassis.
dimensions should not be used as a generic keepout zone for all cooling solutions. It is the system
designer’s responsibility to consider their proprietary cooling solution when designing to the
required keepout zone on their system platform and chassis.
Figure 8-1. Passive Dual-Core Intel
®
Xeon
®
Processor 7000 Series
Thermal Solution (3U and Larger)