jetway v333ur1a Manuel D’Utilisation

 
 
 
                                                                                                                                                                                                                                                                                                                                                         

 
 
 

 

 

1.0   

 

First Release      

  July 2002 

 

 

V333U 

 

Cable for IDE/Floppy 

 

CD for motherboard utilities 

□

  Cable for USB Port 3/4 (Option) 

 

V333U User’s Manual 

 
 

As processor technology pushes to faster speeds and higher performance, thermal 
management becomes increasingly crucial when building computer systems. 
Maintaining the proper thermal environment is key to reliable, long-term system 
operation. The overall goal in providing the proper thermal environment is keeping 
the processor below its specified maximum case temperature. Heatsinks induce 
improved processor heat dissipation through increased surface area and concentrated 
airflow from attached fans. In addition, interface materials allow effective transfers 
of heat from the processor to the heatsink. For optimum heat transfer, AMD 
recommends the use of thermal grease and mounting clips to attach the heatsink to 
the processor.  
When selecting a thermal solution for your system, please refer to the website below 
for collection of heatsinks evaluated and recommended by AMD for use with AMD 
processors. Note, those heatsinks are recommended for maintaining the specified 
Maximum T case requirement. In addition, this collection is not intended to be a 
comprehensive listing of all heatsinks that support AMD processors.  
 
For vendor list of heatsink and fan, please visit：
http://www1.amd.com/products/duron/thermals 
http://www1.amd.com/products/athlon/thermals