Intel X3370 INXEON3370 Fiche De Données
![Intel](https://files.manualsbrain.com/attachments/5a71b1e7f60391972dadeef20435931cbf4621a5/common/fit/150/50/86c99b5f14aeb2708e9a9e1b5305af4ccf882c1af0155dad25413c2ed84e/brand_logo.png)
Codes de produits
INXEON3370
Datasheet
3
Contents
Introduction ..............................................................................................................9
1.1
1.1
Terminology .......................................................................................................9
1.1.1
1.1.1
Processor Terminology Definitions ............................................................ 10
Electrical Specifications ........................................................................................... 13
2.1
2.1
Power and Ground Lands.................................................................................... 13
Voltage Identification ......................................................................................... 14
Reserved, Unused, and TESTHI Signals ................................................................ 16
DC Voltage and Current Specification ........................................................ 18
FSB Signal Groups.................................................................................. 22
CMOS and Open Drain Signals ................................................................. 24
Processor DC Specifications ..................................................................... 24
2.8.3.1
2.8.3.1
GTL+ Front Side Bus Specifications ............................................. 26
Front Side Bus Clock (BCLK[1:0]) and Processor Clocking ............................ 28
BCLK[1:0] Specifications ......................................................................... 30
Package Mechanical Specifications .......................................................................... 33
3.1
3.1
Package Mechanical Specifications ....................................................................... 33
3.1.1
3.1.1
Land Listing and Signal Descriptions ....................................................................... 41
4.1
4.1
Alphabetical Signals Reference ............................................................................ 64
Thermal Specifications and Design Considerations .................................................. 75
5.1
5.1