Fujitsu Xeon S26361-F3099-E828 Fiche De Données

Codes de produits

S26361-F3099-E828

Datasheet

Intel® Xeon™ Processor with 800 MHz System Bus

Contents

Introduction.................................................................................................................................... 9

1.1

Terminology ........................................................................................................................ 10

1.2

References ......................................................................................................................... 12

1.3

State of Data ....................................................................................................................... 12

2.0

Electrical Specifications ............................................................................................................ 13

2.1

Power and Ground Pins...................................................................................................... 13

2.2

Decoupling Guidelines........................................................................................................ 13
2.2.1

Decoupling ..................................................................................................... 13

2.2.2

VTT

Decoupling ..................................................................................................... 13

2.2.3

Front Side Bus AGTL+ Decoupling........................................................................ 13

2.3

Front Side Bus Clock (BCLK[1:0]) and Processor Clocking ............................................... 14
2.3.1

Front Side Bus Frequency Select Signals (BSEL[1:0]).......................................... 14

2.3.2

Phase Lock Loop (PLL) and Filter ......................................................................... 15

2.4

Voltage Identification (VID) ................................................................................................. 15

2.5

Reserved or Unused Pins................................................................................................... 17

2.6

Front Side Bus Signal Groups ............................................................................................ 18

2.7

GTL+ Asynchronous and AGTL+ Asynchronous Signals ................................................... 20

2.8

Test Access Port (TAP) Connection ................................................................................... 21

2.9

Mixing Processors .............................................................................................................. 21

2.10

Absolute Maximum and Minimum Ratings ......................................................................... 21

2.11

Processor DC Specifications .............................................................................................. 22
2.11.1 Flexible Motherboard Guidelines (FMB) ................................................................ 22
2.11.2 VCC Overshoot Specification ................................................................................ 27
2.11.3 Die Voltage Validation ........................................................................................... 28

3.0

Mechanical Specifications .......................................................................................................... 31

3.1

Package Mechanical Drawings........................................................................................... 31

3.2

Processor Component Keepout Zones............................................................................... 34

3.3

Package Loading Specifications......................................................................................... 34

3.4

Package Handling Guidelines............................................................................................. 35

3.5

Package Insertion Specifications........................................................................................ 35

3.6

Processor Mass Specifications........................................................................................... 35

3.7

Processor Materials ............................................................................................................ 35

3.8

Processor Markings ............................................................................................................ 36

3.9

Processor Pinout Coordinates ............................................................................................ 37

4.0

Signal Definitions ....................................................................................................................... 39

4.1

Signal Definitions ................................................................................................................ 39

5.0

Pin List.......................................................................................................................................... 49

5.1

Intel® Xeon™ Processor with 800 MHz System Bus Pin Assignments ............................. 49
5.1.1

Pin Listing by Pin Name......................................................................................... 50

5.1.2

Pin Listing by Pin Number ..................................................................................... 58