Fiche De Données (S26361-F3099-L828)Table des matières1.0 Introduction91.1 Terminology101.2 References121.3 State of Data122.0 Electrical Specifications132.1 Power and Ground Pins132.2 Decoupling Guidelines132.2.1 VCC Decoupling132.2.2 VTT Decoupling132.2.3 Front Side Bus AGTL+ Decoupling142.3 Front Side Bus Clock (BCLK[1:0]) and Processor Clocking142.3.1 Front Side Bus Frequency Select Signals (BSEL[1:0])142.3.2 Phase Lock Loop (PLL) and Filter152.4 Voltage Identification (VID)162.5 Reserved or Unused Pins182.6 Front Side Bus Signal Groups192.7 GTL+ Asynchronous and AGTL+ Asynchronous Signals222.8 Test Access Port (TAP) Connection222.9 Mixing Processors222.10 Absolute Maximum and Minimum Ratings232.11 Processor DC Specifications242.11.1 VCC Overshoot Specification302.11.2 Die Voltage Validation313.0 Mechanical Specifications353.1 Package Mechanical Drawings353.2 Processor Component Keepout Zones383.3 Package Loading Specifications383.4 Package Handling Guidelines393.5 Package Insertion Specifications393.6 Processor Mass Specifications393.7 Processor Materials393.8 Processor Markings403.9 Processor Pinout Coordinates414.0 Signal Definitions434.1 Signal Definitions435.0 Pin List535.1 Low Voltage Intel® Xeon™ Processor with 800 MHz System Bus Pin Assignments535.1.1 Pin Listing by Pin Name545.1.2 Pin Listing by Pin Number626.0 Thermal Specifications716.1 Package Thermal Specifications716.1.1 Thermal Specifications716.1.2 Thermal Metrology746.2 Processor Thermal Features746.2.1 Thermal Monitor746.2.2 On-Demand Mode756.2.3 PROCHOT# Signal Pin756.2.4 FORCEPR# Signal Pin756.2.5 THERMTRIP# Signal Pin766.2.6 TCONTROL and Fan Speed Reduction766.2.7 Thermal Diode767.0 Features797.1 Power-On Configuration Options797.2 Clock Control and Low Power States797.2.1 Normal State807.2.2 HALT Power-Down State807.2.3 Stop-Grant State827.2.4 HALT Snoop State or Snoop State827.2.5 Sleep State838.0 Debug Tools Specifications858.1 Debug Port System Requirements858.2 Target System Implementation858.2.1 System Implementation858.3 Logic Analyzer Interface (LAI)858.3.1 Mechanical Considerations868.3.2 Electrical Considerations86Taille: 1,3 MoPages: 86Language: EnglishOuvrir le manuel