Intel 200 Manuale Utente

40  

 

Thermal and Mechanical Design Guidelines 

Thermal performance degradation due to TIM degradation is evaluated using power 

cycling testing.  The test is defined by 7500 cycles for the heatsink temperature from 

room temperature (~23 ºC) to T

S-TOP-MAX

 at usage power consumption.   

This test is to ensure proper operation of the product before and after environmental 

stresses, with the thermal mechanical enabling components assembled.  The test shall 

be conducted on a fully operational motherboard that has not been exposed to any 

battery of tests prior to the test being considered.  

Testing setup should include the following components, properly assembled and/or 

connected: 

•  Appropriate system motherboard 

•  Processor 

•  All enabling components, including socket and thermal solution parts 

•  Power supply 

•  Disk drive 

•  Video card 

•  DIMM 

•  Keyboard  

•  Monitor 

The pass criterion is that the system under test shall successfully complete the 

checking of BIOS, basic processor functions and memory, without any errors. 

Material shall be resistant to fungal growth.  Examples of non-resistant materials 

include cellulose materials, animal and vegetable based adhesives, grease, oils, and 

many hydrocarbons.  Synthetic materials such as PVC formulations, certain 

polyurethane compositions (e.g., polyester and some polyethers), plastics which 

contain organic fillers of laminating materials, paints, and varnishes also are 

susceptible to fungal growth.  If materials are not fungal growth resistant, then MIL-

STD-810E, Method 508.4 must be performed to determine material performance. 

Material used shall not have deformation or degradation in a temperature life test. 

Any plastic component exceeding 25 grams must be recyclable per the European Blue 

Angel recycling standards.