Intel L5618 AT80614005079AB Manuale Utente
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AT80614005079AB
Intel
®
Xeon
®
Processor 5600 Series Datasheet Volume 1
113
Thermal Specifications
7
Thermal Specifications
7.1
Package Thermal Specifications
The processor requires a thermal solution to maintain temperatures within operating
limits. Any attempt to operate the processor outside these limits may result in
permanent damage to the processor and potentially other components within the
system. Maintaining the proper thermal environment is key to reliable, long-term
system operation.
limits. Any attempt to operate the processor outside these limits may result in
permanent damage to the processor and potentially other components within the
system. Maintaining the proper thermal environment is key to reliable, long-term
system operation.
A complete solution includes both component and system level thermal management
features. Component level thermal solutions can include active or passive heatsinks
attached to the processor integrated heat spreader (IHS). Typical system level thermal
solutions may consist of system fans combined with ducting and venting.
features. Component level thermal solutions can include active or passive heatsinks
attached to the processor integrated heat spreader (IHS). Typical system level thermal
solutions may consist of system fans combined with ducting and venting.
This section provides data necessary for developing a complete thermal solution. For
more information on designing a component level thermal solution, refer to the Intel®
Xeon® Processor 5500/5600 Series Thermal/Mechanical Design Guide.
more information on designing a component level thermal solution, refer to the Intel®
Xeon® Processor 5500/5600 Series Thermal/Mechanical Design Guide.
Note:
The boxed processor will ship with a component thermal solution. Refer to
for
details on the boxed processor.
7.1.1
Thermal Specifications
To allow optimal operation and long-term reliability of Intel processor-based systems,
the processor must remain within the minimum and maximum case temperature
(T
the processor must remain within the minimum and maximum case temperature
(T
CASE
) specifications as defined by the applicable thermal profile. Thermal solutions
not designed to provide sufficient thermal capability may affect the long-term reliability
of the processor and system. For more details on thermal solution design, please refer
to the Intel® Xeon® Processor 5500/5600 Series Thermal/Mechanical Design Guide.
of the processor and system. For more details on thermal solution design, please refer
to the Intel® Xeon® Processor 5500/5600 Series Thermal/Mechanical Design Guide.
The processors implement a methodology for managing processor temperatures which
is intended to support acoustic noise reduction through fan speed control and to assure
processor reliability. Selection of the appropriate fan speed is based on the relative
temperature data reported by the processor’s Platform Environment Control Interface
(PECI) as described in
is intended to support acoustic noise reduction through fan speed control and to assure
processor reliability. Selection of the appropriate fan speed is based on the relative
temperature data reported by the processor’s Platform Environment Control Interface
(PECI) as described in
. If PECI is less than TCONTROL, then the case
temperature is permitted to exceed the Thermal Profile, but PECI must remain at or
below TCONTROL. If PECI >= TCONTROL, then the case temperature must meet the
Thermal Profile. The temperature reported over PECI is always a negative value and
represents a delta below the onset of thermal control circuit (TCC) activation, as
indicated by PROCHOT# (see
below TCONTROL. If PECI >= TCONTROL, then the case temperature must meet the
Thermal Profile. The temperature reported over PECI is always a negative value and
represents a delta below the onset of thermal control circuit (TCC) activation, as
indicated by PROCHOT# (see
, Processor Thermal Features). Systems that
implement fan speed control must be designed to use this data. Systems that do not
alter the fan speed only need to guarantee the case temperature meets the thermal
profile specifications.
alter the fan speed only need to guarantee the case temperature meets the thermal
profile specifications.
Thermal Profiles are broken out separately for the Intel Xeon processor 5600 series 6-
core and 4-core SKUs. This reflects different Thermal Test Vehicle (TTV) Correction
Factors (CFs), resulting from different power density characteristics associated with the
different number of cores. There is no difference in platform thermal solution
assumptions or boundary conditions between the 6-core and 4-core SKUs for a given
FMB (e.g., 130W). For the latest TTV CFs, please refer to the Intel® Xeon® Processor
5500/5600 Series Thermal/Mechanical Design Guide.
core and 4-core SKUs. This reflects different Thermal Test Vehicle (TTV) Correction
Factors (CFs), resulting from different power density characteristics associated with the
different number of cores. There is no difference in platform thermal solution
assumptions or boundary conditions between the 6-core and 4-core SKUs for a given
FMB (e.g., 130W). For the latest TTV CFs, please refer to the Intel® Xeon® Processor
5500/5600 Series Thermal/Mechanical Design Guide.