Intel L5618 AT80614005079AB Manuale Utente

Codici prodotto
AT80614005079AB
Pagina di 184
Intel
®
 Xeon
®
 Processor 5600 Series Datasheet Volume 1
67
Package Mechanical Specifications
4
Package Mechanical 
Specifications
4.1
Package Mechanical Specifications
The processor is packaged in a Flip-Chip Land Grid Array (FC-LGA) package that 
interfaces with the baseboard via an LGA1366 socket. The package consists of a 
processor mounted on a substrate land-carrier. An integrated heat spreader (IHS) is 
attached to the package substrate and core and serves as the mating surface for 
processor component thermal solutions, such as a heatsink. 
 shows a sketch 
of the processor package components and how they are assembled together. Refer to 
the Intel
®
 Xeon
®
 Processor 5500/5600 Series Thermal/Mechanical Design Guide for 
complete details on the LGA1366 socket.
The package components shown in 
1. Integrated Heat Spreader (IHS)
2. Thermal Interface Material (TIM)
3. Processor core (die)
4. Package substrate
5. Capacitors
Note:
1.
Socket and baseboard are included for reference and are not part of processor package.
4.1.1
Package Mechanical Drawing
The package mechanical drawings are shown in 
. The 
drawings include dimensions necessary to design a thermal solution and reflect the 
processor as received by Intel. These dimensions include:
1. Package reference with tolerances (total height, length, width, and so forth)
2. IHS parallelism and tilt
3. Land dimensions
4. Top-side and back-side component keep-out dimensions
5. Reference datums
Figure 4-1. Processor Package Assembly Sketch
IHS
Substrate 
LGA1366 Socket
System Board 
Capacitors 
 
TIM
IHS
Substrate 
LGA 
System Board 
Capacitors 
Die
TIM