Intel L5618 AT80614005079AB Manuale Utente

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Package Mechanical Specifications
70
Intel
®
 Xeon
®
 Processor 5600 Series Datasheet Volume 1
4.1.2
Processor Component Keep-Out Zones
The processor may contain components on the substrate that define component 
keep-out zone requirements. A thermal and mechanical solution design must not 
intrude into the required keep-out zones. Do not contact the Test Pad Area with 
conductive material. Decoupling capacitors are typically mounted to either the topside 
or land-side of the package substrate. See 
 an
 for keep-out 
zones. The location and quantity of package capacitors may change due to 
manufacturing efficiencies but will remain within the component keep-in.
4.1.3
Package Loading Specifications
 provides load specifications for the processor package. These maximum 
limits should not be exceeded during heatsink assembly, shipping conditions, or 
standard use condition. Exceeding these limits during test may result in component 
failure. The processor substrate should not be used as a mechanical reference or load-
bearing surface for thermal solutions.
.
Notes:
1.
These specifications apply to uniform compressive loading in a direction normal to the processor IHS.
2.
This is the maximum static force that can be applied by the heatsink and Independent Loading Mechanism 
(ILM). 
3.
These specifications are based on limited testing for design characterization. Loading limits are for the 
package constrained by the limits of the processor socket. 
4.
Dynamic loading is defined as an 11 ms duration average load superimposed on the static load 
requirement.
5.
See Intel® Xeon® Processor 5500/5600 Series Thermal/Mechanical Design Guide for minimum socket load 
to engage processor within socket.
4.1.4
Package Handling Guidelines
 includes a list of guidelines on package handling in terms of recommended 
maximum loading on the processor IHS relative to a fixed substrate. These package 
handling loads may be experienced during heatsink removal.
4.1.5
Package Insertion Specifications
The processor can be inserted into and removed from an LGA1366 socket 15 times. The 
socket should meet the LGA1366 requirements detailed in the Intel
®
 Xeon
®
 Processor 
5500/5600 Series Thermal/Mechanical Design Guide.
Table 4-1.
Processor Loading Specifications
Parameter
Maximum
Notes
Static Compressive Load
890 N [200 lbf]
1, 2, 3
Dynamic Compressive Load
1779 N [400 lbf] [max static compressive + dynamic load]
1, 3, 4
Table 4-2.
Package Handling Guidelines
Parameter
Maximum Recommended
Notes
Shear
70 lbs
Tensile
25 lbs
Torque
35 in.lbs