3M gold finger masking for wave solder or solder reflow processes Manuale Utente
Application Tips
Due to the low bond strength of the tape, the user may observe some lifting on the edges after the PCB has gone through
the process. The following suggestions may be used to prevent lifting:
the process. The following suggestions may be used to prevent lifting:
1. Wrap tape around the board and adhere to the back, leaving the end on the top side of the board and not
exposed to the solder wave.
2. Use a small piece of 3M
™
Low Static Polyimide Film Tape 5419 to hold down the edges with minimum risk
of contamination.
Industrial Markets
3M Center, Building 220-8E-04
St. Paul, MN 55144-1000
3M Center, Building 220-8E-04
St. Paul, MN 55144-1000
Printed in USA
Egfm5563.qxd
© 3M 2002
Egfm5563.qxd
© 3M 2002
For Additional Information
To request additional product information or to arrange for sales assistance, call 1-800-362-3550. Address
correspondence to: 3M Industrial Markets Customer Response Center, 3M Center, Building 220-8E-04,
St. Paul, MN 55144-1000. Our fax number is 651-733-9175. In Canada, phone: 1-800-364-3577. In
Puerto Rico, phone: 1-787-750-3000. In Mexico, phone: 52-70-04-00.
correspondence to: 3M Industrial Markets Customer Response Center, 3M Center, Building 220-8E-04,
St. Paul, MN 55144-1000. Our fax number is 651-733-9175. In Canada, phone: 1-800-364-3577. In
Puerto Rico, phone: 1-787-750-3000. In Mexico, phone: 52-70-04-00.
Important Notice
3M MAKES NO WARRANTIES, EXPRESS OR IMPLIED, INCLUDING, BUT NOT LIMITED TO,
ANY IMPLIED WARRANTY OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR
PURPOSE. All statements, technical information and recommendations contained in this document are
based upon tests we believe to be reliable. However, many factors beyond the control of 3M can affect the
use and performance of 3M products in a particular application, including the conditions under which the
product is used and the time and environmental conditions in which the product is expected to perform.
Since these factors are uniquely within the user’s knowledge and control, it is essential that the user
evaluate the 3M product to determine whether this product is fit for a particular purpose and suitable for
the user’s application.
ANY IMPLIED WARRANTY OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR
PURPOSE. All statements, technical information and recommendations contained in this document are
based upon tests we believe to be reliable. However, many factors beyond the control of 3M can affect the
use and performance of 3M products in a particular application, including the conditions under which the
product is used and the time and environmental conditions in which the product is expected to perform.
Since these factors are uniquely within the user’s knowledge and control, it is essential that the user
evaluate the 3M product to determine whether this product is fit for a particular purpose and suitable for
the user’s application.
Limitation of Remedies
and Liability
and Liability
If the 3M product is proved to be defective, THE EXCLUSIVE REMEDY, AT 3M’S OPTION, SHALL
BE TO REFUND THE PURCHASE PRICE OF OR TO REPAIR OR REPLACE THE DEFECTIVE 3M
PRODUCT. 3M shall not otherwise be liable for any loss or damages, whether direct, indirect, special,
incidental, or consequential, regardless of the legal theory asserted, including, but not limited to, contract,
negligence, warranty, or strict liability.
BE TO REFUND THE PURCHASE PRICE OF OR TO REPAIR OR REPLACE THE DEFECTIVE 3M
PRODUCT. 3M shall not otherwise be liable for any loss or damages, whether direct, indirect, special,
incidental, or consequential, regardless of the legal theory asserted, including, but not limited to, contract,
negligence, warranty, or strict liability.
Key Decision Makers
Manufacturing and Production Engineers
Static Control Engineers
Related Application Idea
Masking for chip on flex connection area during solder
reflow process. This helps reduce contamination and
improve the ACF connection of the flex circuit to LCD bond.
A typical example is the ACF connection of Chip on Flex to
color LCD for cell phones (shown in illustration at right).
reflow process. This helps reduce contamination and
improve the ACF connection of the flex circuit to LCD bond.
A typical example is the ACF connection of Chip on Flex to
color LCD for cell phones (shown in illustration at right).
3M™ Non-Silicone High Temperature Masking Tape 5563
protects the gold fingers on the flex socket attached to the
LCD with AFC. Acrylic adhesive used in 5563 Tape will
not contaminate the masked area with silicone that may cause
failure in the AFC connection.
protects the gold fingers on the flex socket attached to the
LCD with AFC. Acrylic adhesive used in 5563 Tape will
not contaminate the masked area with silicone that may cause
failure in the AFC connection.
3M
™
Non-Silicone High Temperature Masking Tape 5563