Manuali utente per Hitachi GR2000

Sommario

• Table of Contents

  31
  • Chapter 1 - General Information 1-1

    31
    • 1.1 Purpose and Organization of This Manual 1-1

      31
    • 1.2 Outline of Installation Process 1-2

      31
  • Chapter 2 - Product Overview 2-1

    31
    • 2.1 Models 2-1

      31
    • 2.2 Physical Appearance 2-2

      31
    • 2.3 Device Configuration 2-20

      31
    • 2.4 Device Components 2-28

      31
    • 2.5 Connections 2-40

      31
  • Chapter 3 - Component Details 3-1

    32
    • 3.1 Cabinet (Chassis) 3-1

      32
    • 3.2 Module Characteristics 3-3

      32
    • 3.3 Basic Control Unit (BCU) 3-4

      32
    • 3.4 Routing Processor (RP) 3-16

      32
    • 3.5 Network Interface Module (NIF) 3-18

      32
    • 3.6 Power Supply Unit (POW) 3-65

      33
    • 3.7 Memory Module (MS64, MS128 and MS256) 3-74

      33
    • 3.8 Memory Card Module (MC30 and MC64) 3-75

      33
    • 3.9 Fittings 3-75

      33
    • 3.10 Customer-Responsibility Interface Cables 3-84

      33
  • Chapter 4 - Precautions in Planning Installation 4-1

    34
    • 4.1 Prerequisites 4-1

      34
    • 4.2 Configuration Limits 4-7

      34
    • 4.3 Segmentation/Topology Restrictions 4-50

      35
    • 4.4 LAN Networking Restrictions 4-51

      35
    • 4.5 WAN Networking Restrictions 4-52

      35
    • 4.6 ATM Networking Restrictions 4-58

      35
    • 4.7 Precautions on IP Connection with Other Devices 4-64

      36
    • 4.8 Precautions When Replacing Other Router with GR2000 4-67

      36
    • 4.9 Connection with IPv6 Router 4-68

      36
    • 4.10 Precautions on IPX Connection 4-73

      36
    • 4.11 Precautions on Bridge Connections 4-76

      37
    • 4.12 Precautions on QoS Control 4-79

      37
    • 4.13 Caution on Use of Tag-VLAN 4-81

      37
    • 4.14 Precautions for using IP multicast 4-83

      37
    • 4.15 Precautions for using MPLS 4-89

      37
  • Chapter 5 - Installation Site Conditions 5-1

    38
    • 5.1 Environmental Requirements 5-1

      38
    • 5.2 Power and Cooling Requirements 5-6

      38
    • 5.3 Layout 5-17

      38
  • Chapter 6 - Hardware Installation 6-1

    38
    • 6.1 Unpacking 6-1

      38
    • 6.2 Handling of Components Subject to Static Electricity 6-11

      39
    • 6.3 Installation of Chassis 6-12

      39
    • 6.4 Routing and Connection of Cables 6-40

      39
    • 6.5 Mounting and Unmounting of Flash Memory Card (MC) 6-62

      39
    • 6.6 Handling of GBIC 6-64

      39
    • 6.7 Connection of Setup Console 6-65

      39
  • Chapter 7 - Starting, Setting Up, and Stopping 7-1

    40
    • 7.1 Overview of Device Operation 7-1

      40
    • 7.2 Starting the Router 7-2

      40
    • 7.3 Restarting the Router 7-2

      40
    • 7.4 Setting Up Initial Configuration 7-3

      40
    • 7.5 Stopping the Router 7-3

      40
  • Chapter 8 - Adding and Removing Components 8-1

    40
    • 8.1 BCU, RP, and NIF Modules 8-1

      40
    • 8.2 Power Supply Components 8-5

      40
    • 8.3 Fans 8-17

      40
    • 8.4 Main Memory Module 8-20

      40
    • 8.5 Hot-Swapping of Components 8-21

      40
  • Chapter 9 - Software Installation and Updates 9-1

    41
    • 9.1 Introduction 9-1

      41
    • 9.2 Supplied Media and Equipment Required 9-1

      41
      • List of Figures

        43
      • Chapter 1 - General Information 1-1

        43
      • Chapter 2 - Product Overview 2-1

        43
      • Chapter 3 - Component Details 3-1

        43
      • Chapter 4 - Precautions in Planning Installation 4-1

        45
      • Chapter 5 - Installation Site Conditions 5-1

        46
      • Chapter 6 - Hardware Installation 6-1

        46
      • Chapter 7 - Starting, Setting Up, and Stopping 7-1

        48
      • Chapter 8 - Adding and Removing Components 8-1

        48
      • Chapter 9 - Software Installation and Updates 9-1

        48
      • List of Tables

        49
• Chapter 1 General Information

  55
  • 1.1 Purpose and Organization of This Manual

    55
  • 1.2 Outline of Installation Process

    56
• Chapter 2 Product Overview

  57
  • 2.1 Models

    57
  • 2.2 Physical Appearance

    58
  • 2.3 Device Configuration

    76
  • 2.4 Device Components

    84
    • 2.4.1 Cabinet (Network Processor Unit Chassis)

      85
    • 2.4.2 Basic Control Unit (BCU)

      85
      • 2.4.2.1 RM-CPU

        86
      • 2.4.2.2 RM-IO

        86
      • 2.4.2.3 RMB-CPU

        86
      • 2.4.2.4 RMB-IO

        86
      • 2.4.2.5 Crossbar Switch (CSW)

        87
    • 2.4.3 Routing Processor Module(RP)

      87
    • 2.4.4 Network Interface Module (NIF)

      90
    • 2.4.5 Power Supply Unit (POW)

      92
    • 2.4.6 CPU Fan

      92
    • 2.4.7 Main Storage Card (MS)

      92
    • 2.4.8 Flash Memory Card (MC)

      92
    • 2.4.9 Interface Cables

      93
    • 2.4.10 NIF accessory (GBIC)

      93
    • 2.4.11 Temperature monitoring sensor

      93
    • 2.4.12 Software

      94
  • 2.5 Connections

    96
    • 2.5.1 Interface Cables and Connectors

      96
      • 2.5.1.1 LAN

        98
      • 2.5.1.2 WAN

        99
      • 2.5.1.3 ATM

        100
    • 2.5.2 Network Connections

      100
      • 2.5.2.1 LAN Connection

        100
      • 2.5.2.2 WAN Connection

        101
      • 2.5.2.3 ATM Connection

        101
• Chapter 3 Component Details

  103
  • 3.1 Cabinet (Chassis)

    103
  • 3.2 Module Characteristics

    105
  • 3.3 Basic Control Unit (BCU)

    106
    • 3.3.1 RM-CPU(2S)

      106
    • 3.3.2 RMP (2S)

      107
    • 3.3.3 RM-CPU(4S), RMB-CPU (4S), RM-CPU(HH), RMB-CPU (HH), RM-CPU(MH), RMB-CPU (MH), RM-CPU(LH) an...

      110
    • 3.3.4 RM-CPU(S), RM-CPU(M), RM-CPU(MC2) and RM-CPU(L)

      112
    • 3.3.5 RM-IO(4S), RMB-IO (4S) and RM-IO(H)

      113
    • 3.3.6 RM-IO(S), RM-IO(M), and RM-IO(L)

      116
    • 3.3.7 RMB-IO(H)

      117
    • 3.3.8 CSW

      117
  • 3.4 Routing Processor (RP)

    118
    • 3.4.1 RP-A1/RP-D/RP-D6

      118
    • 3.4.2 RP-C/RP-C6

      119
  • 3.5 Network Interface Module (NIF)

    120
    • 3.5.1 NE100-8T, NE100-8TA and NE100-8TB

      121
    • 3.5.2 NE100-4F, NE100-4FS, and NE100-4FS4

      122
    • 3.5.3 NE1G-1S, NE1G-1SA, NE1G-1L, NE1G-1LA, NE1G-1LHA, NE1G-1LHA8, NE1G-1LB, NE1G-1SB and NE1G-1LHBA

      123
    • 3.5.4 NWVX-4

      124
    • 3.5.5 NWVX-8

      127
    • 3.5.21 NWOC48-1A, NWOC48-1A4 and NWOC48-1A8

      156
    • 3.6.1 POW-S100S

      168
    • 3.6.3 POW-HDCH

      169
    • 3.6.10 POW-M100 and POW-L200

      175
  • 3.9 Fittings

    177
    • 3.9.3 V.24, V.35, and X.21 Interface Cables

      178
      • 3.10.2.2 UTP Cable for Primary (I.431 or I.431-a)

        194
      • 3.10.2.4 Metal (Coaxial) Cable for Secondary (G.703)

        196
      • 3.10.2.6 Multimode Optical Fiber Cable for OC-3c/STM-1 (POS) MMF

        197
  • 4.1 Prerequisites

    205
    • 4.1.1 Local Setup Console and Remote Operation Terminal

      205
    • 4.2.1 RP

      211
      • 4.2.4.3 Line Accommodation with WAN (Other than ISDN and Overload)

        216
      • 4.2.4.5 Line Accommodation with WAN (Overload)

        218
      • 4.2.4.9 Line accommodating conditions for ATM

        224
      • 4.2.5.1 Maximum Number of ARP Entries

        225
    • 4.2.6 Maximum Number of Interfaces and Multihome Subnets

      226
      • 4.2.6.1 Maximum Number of Interfaces

        226
      • 4.2.7.1 Maximum Number of Neighbor Routers

        227
    • 4.2.11 MPLS/IP-VPN [ROUTE-OS3]

      231
      • 4.2.11.3 Memory Card Unit (MC)

        234
      • 4.2.11.4 Minimum Memory Requirements

        234
      • 4.2.11.7 Dynamic Entry and Static Entry Maximum Entry Count

        242
    • 4.2.12 IPv6 [ROUTE-OS6]

      243
      • 4.2.12.2 IPv6 function restrictions regarding the routing processing mechanism (RP) mounting cond...

        244
      • 4.2.12.4 Number of NDP Entries

        246
      • 4.2.12.8 Maximum Number of IPv6 Addresses to be Set

        248
      • 4.2.12.9 Routing Resource

        249
    • 4.2.13 Tag-VLAN

      251
      • 4.2.13.1 Routing Processor Module (RP) and NIF

        251
      • 4.2.13.3 Number of Tag-VLANs to be Set in Multi-Home

        252
    • 4.3.1 Items to be Prepared

      254
    • 4.3.2 Network Configuration

      254
    • 4.4.1 10BASE-T/100BASE-TX

      255
    • 4.4.2 100BASE-FX

      255
    • 4.4.3 1000BASE-SX/1000BASE-LX/1000BASE-LH

      255
  • 4.5 WAN Networking Restrictions

    256
    • 4.5.1 Required Settings on GR2000 for Connecting Other Devices on PPP

      256
      • 4.5.2.4 Conditions When Submitting Application Form to Frame Relay Network

        257
      • 4.5.2.5 Packet Length

        257
      • 4.5.3.1 Required Setting on GR2000 for POS in Multivendor Environment

        260
    • 4.6.1 Bandwidth Planning Considerations

      262
      • 4.6.1.1 Routing Capacity of GR2000 on ATM Interface

        262
      • 4.6.1.2 Cellularization Overhead

        262
      • 4.6.2.1 ATM Connection with Hitachi NP200 and NP220

        265
    • 4.6.4 Function-wise Conditions for ATM Connection

      267
      • 4.6.4.1 ATM Connection with IPX Devices

        267
      • 4.6.4.2 ATM Connection with Bridge Devices

        267
    • 4.7.1 Interface Address in Point-to-Point Line Connection

      268
    • 4.7.6 Cautions When Using OSPF on Point-to-Point Circuits

      269
      • 4.7.8.1 Cautions Regarding NextHop Resolution

        270
    • 4.9.1 Connection with IPv6 Router

      272
      • 4.9.1.1 Interface Address of Point-to-Point Type Line

        272
      • 4.9.1.3 Caution When Changing the MTU Length of IPv6 Relay Line

        273
      • 4.9.1.6 IPv6 function that can be used at IPv6 relaying software processing

        275
    • 4.10.1 Configuration Settings

      277
      • 4.10.1.1 Setting of RIP Packet Processing

        277
      • 4.10.1.2 Setting of SAP Packet Processing

        277
      • 4.10.1.4 Use of NetWare 4.1

        278
      • 4.10.2.2 Model Traffic of Periodic SAP Packets

        279
      • 4.10.2.3 Traffic of Periodic RIP and Periodic SAP Packets on Group-Defined Interface

        279
    • 4.11.1 Protocol and Topology Restrictions

      280
      • 4.11.1.1 Spanning-Tree Protocol

        280
    • 4.11.6 Bridge Definition on ISDN Interface

      282
    • 4.12.1 Relationship Between Load on RP and QoS

      283
    • 4.13.1 Connection with LAN Switch

      285
      • 4.13.1.1 VLAN type

        285
      • 4.13.1.2 Tag-VLAN setting

        285
    • 4.14.1 Multicast relay

      287
      • 4.14.1.1 Common to protocols

        287
    • 4.14.2 Redundant route (route switching due to impediment)

      288
      • 4.14.2.1 When using PIM-DM

        288
      • 4.14.2.2 When using DVMRP

        288
      • 4.14.3.1 PIM-DM

        289
  • 4.15 Precautions for using MPLS

    293
    • 4.15.1 Non-permitted mixed use of LSP allocation system for each VPN and RFC2547 bis system

      293
    • 4.15.4 Difference in IP-VPN of the LSP allocation system for each VPN using software version

      294
      • 4.15.4.3 Versions prior to Ver. 05-00

        295
  • 5.1 Environmental Requirements

    297
    • 5.1.1 Temperature and Humidity

      297
    • 5.1.7 Acoustic Noise

      300
    • 5.2.1 Input Power Requirements

      302
      • 5.2.2.1 100V ac Input (GR2000-2S, GR2000-4S, GR2000-6H, GR2000-10H, GR2000-4, GR2000-10)

        303
      • 5.2.7.3 Cooling Requirements for Rack-Mount Installation

        313
  • 6.1 Unpacking

    315
    • 6.1.1 Chassis

      315
  • 6.2 Handling of Components Subject to Static Electricity

    325
    • 6.3.3 Floor Installation of Chassis

      328
      • 6.3.4.1 Rack-Mount Installation of Small-Scale Chassis—GR2000-2S, GR2000-4, GR2000-4S, GR2000-6H

        337
    • 6.4.1 General Rules for Routing and Connection of Cables

      354
      • 6.4.2.1 GR2000-2S

        358
      • 6.4.2.5 GR2000-20H

        363
      • 6.4.2.6 GR2000-4

        366
    • 6.4.3 Connection of Interface Cables

      372
      • 6.4.3.1 LAN: 10BASE-T and 100BASE-TX

        372
      • 6.4.3.3 WAN: V.24, V.35, and X.21

        373
      • 6.4.3.7 ATM/MMF/SMF: OC-3c ATM/MMF, OC-3c ATM/SMF, OC-12c/ATM/MMF and OC-12c ATM/SMF

        375
  • 7.1 Overview of Device Operation

    381
  • 8.1 BCU, RP, and NIF Modules

    385
    • 8.2.1 GR2000-4S

      389
      • 8.2.3.1 Input Unit (AC or DC)

        392
      • 8.2.4.1 Input Unit (AC or DC)

        394
      • 8.2.6.1 POW for AC Input

        397
      • 8.2.7.1 POW for AC Input

        399
    • 8.3.1 Fan Tray for GR2000-10H

      401
    • 8.4.1 Addition/Removal of Main Memory Module for RM (BCU)

      404
      • 8.5.1.2 Removing a BCU

        406
      • 8.5.2.1 Adding an RP

        407
      • 8.5.2.2 Removing an RP

        407
    • 8.5.3 Network Interface (NIF)

      407
  • 9.1 Introduction

    409